IP Library › Granted Patent US 11,794,281
Granted Patent B2
US 11,794,281 · App. 16/635,808 · Granted Oct 24, 2023

Laser processing

Inventor: Ian James Thomson (Rosyth, GB)
Assignee: RENISHAW PLC
B23K26/342B22F10/28B22F12/49B23K26/0626B23K26/0643B23K26/0648B23K26/0652B23K26/082B23K26/34B29C64/153B29C64/268B29C64/286B29C64/393B22F10/36B22F10/366B33Y10/00B33Y30/00B33Y50/02
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Quick Facts
Patent No.
US 11,794,281
App. No.
16/635,808
Granted
Oct 24, 2023
Kind
B2
Abstract

A method of laser processing including generating a laser beam having, at different longitudinal positions in a propagation direction, first and second transverse beam profiles of energy density. The first transverse beam profile is different to the second transverse beam profile and is non-Gaussian. The method includes carrying out a scan of the laser beam across a working surface, wherein, during the scan, the laser beam and/or working surface is adjusted such that, for a first part of the scan, the first transverse beam profile is located at the working surface and, for a second part of the scan, the second transverse beam profile is located at the working surface.

Claims (28)

1. A method of laser processing comprising:

generating a laser beam having, at different longitudinal positions in a propagation direction, first and second transverse beam profiles of energy density, the first transverse beam profile at a focal point of the laser beam having a flatter-top than the second transverse beam profile away from the focal point of the laser beam; and

carrying out a scan of the laser beam across a working surface,

wherein, during the scan, at least one of the laser beam and the working surface is adjusted to adjust a relative position of the working surface to the focal point such that, for a first part of the scan, the first transverse beam profile is located at the working surface and, for a second part of the scan, the second transverse beam profile is located at the working surface.

2. The method according to claim 1 , wherein the first transverse beam profile is flatter than the second transverse beam profile in accordance with a measure of flatness.

3. The method according to claim 2 , wherein the measure of flatness is one or more of a flatness factor, beam uniformity, plateau uniformity and edge steepness as defined within the EN ISO 13694-2001 standard.

4. The method according to claim 1 , wherein the first transverse beam profile is flatter than a corresponding Gaussian profile having the same total and peak energies as the first transverse beam profile.

5. The method according to claim 1 , wherein, in a plane transverse to the propagation direction, the first transverse beam profile comprises a ring about a central spot.

6. The method according to claim 1 , wherein the laser processing comprises an additive manufacturing process, wherein the laser beam is used to solidify material to form a component, the method comprising using the second transverse beam profile to solidify material to form component surfaces and using the first transverse beam profile to solidify material to form a core of the component.

7. A controller for controlling a laser processing apparatus to carry out a method of laser processing according to claim 1 .

8. A non-transient data carrier having instructions thereon, which, when executed by a processor of an apparatus, causes the apparatus to carry out a method of laser processing according to claim 1 .

9. A method of laser processing comprising:

generating a laser beam having, at different longitudinal positions in a propagation direction, first and second transverse beam profiles of energy density, the first transverse beam profile at a focal point of the laser beam being a super-Gaussian shape and the second transverse beam profile away from the focal point of the laser beam being a Gaussian shape; and

carrying out a scan of the laser beam across a working surface,

wherein, during the scan, at least one of the laser beam and the working surface is adjusted to adjust a relative position of the working surface to the focal point such that, for a first part of the scan, the first transverse beam profile is located at the working surface and, for a second part of the scan, the second transverse beam profile is located at the working surface.

10. The method according to claim 9 , wherein the super-Gaussian shape is a second order super-Gaussian.

11. A controller for controlling a laser processing apparatus to carry out a method of laser processing according to claim 9 .

12. A non-transient data carrier having instructions thereon, which, when executed by a processor of an apparatus, causes the apparatus to carry out a method of laser processing according to claim 9 .

13. A method of laser processing comprising:

generating a laser beam having, at different longitudinal positions in a propagation direction, first and second transverse beam profiles of energy density, the first transverse beam profile at a focal point of the laser beam being a super-Gaussian shape and having a flatter-top than the second transverse beam profile away from the focal point of the laser beam; and

carrying out a scan of the laser beam across a working surface,

wherein, during the scan, at least one of the laser beam and working surface is adjusted to adjust a relative position of the working surface to the focal point such that, for a first part of the scan, the first transverse beam profile is located at the working surface and, for a second part of the scan, the second transverse beam profile is located at the working surface.

14. The method according to claim 13 , wherein the super-Gaussian shape is a second order super-Gaussian.

15. The method according to claim 13 , wherein the first transverse beam profile is flatter than the second transverse beam profile in accordance with a measure of flatness.

16. The method according to claim 15 , wherein the measure of flatness is one or more of a flatness factor, beam uniformity, plateau uniformity and edge steepness as defined within the EN ISO 13694-2001 standard.

17. The method according to claim 13 , wherein the first transverse beam profile is flatter than a corresponding Gaussian profile having the same total and peak energies as the first transverse beam profile.

18. A controller for controlling a laser processing apparatus to carry out a method of laser processing according to claim 13 .

19. A non-transient data carrier having instructions thereon, which, when executed by a processor of an apparatus, causes the apparatus to carry out a method of laser processing according to claim 13 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2020
From: THOMSON, IAN JAMES
To: RENISHAW PLC
Reel/Frame 051686/0343 →
Priority Claims (1)
GB 1712739 · Aug 9, 2017 · national
Continuity (1)
Related Publication 20210129426A1 · May 6, 2021