Adhesive formulation
An adhesive composition including an epoxy-based adhesive polymer and a phosphorous element-containing compound; a process for making the adhesive composition; a process for increasing the corrosion resistance property of the adhesive composition; and a process for bonding a metal substrate with the adhesive composition to increase the corrosion resistance of the substrate by at least 40 percent.
1. An adhesive composition comprising
(I) 40-65 wt % of an epoxy-based adhesive polymer; and
(II) a phosphorous element-containing compound, which is a mixture of phosphoethyl methacrylate monoester, phosphoethyl methacrylate diester, phosphoric acid, and methyl methacrylate; and
(III) an epoxy curing catalyst.
2. The adhesive composition of claim 1 , wherein the epoxy-based adhesive polymer is a mixture comprising: (a) a curable epoxy compound or a combination of two or more curable epoxy compounds; (b) one or more reactive urethane group- and/or urea group-containing polymers having a number average molecular weight of up to 35,000, at least one polyether and/or diene rubber segment having a weight of at least 1,000 atomic mass units, and capped isocyanate groups, (c) at least one epoxy curing catalyst, and (d) a curing agent.
3. The adhesive composition of claim 1 , wherein the epoxy-based adhesive polymer is bisphenol A diglycidylether.
4. The adhesive composition of claim 1 , wherein the epoxy-based adhesive polymer is a urea toughening polymer.
5. The composition of claim 1 , wherein the amount of epoxy-based adhesive polymer is from about 40 weight percent to about 60 weight percent.
6. The composition of claim 1 , wherein the amount of phosphorous element-containing compound is up to about 20 weight percent.
7. The composition of claim 1 , wherein the amount of phosphorous element-containing compound is from about 0.1 weight percent to about 5 weight percent.