Array substrate with first gate, second gate, binding region with hole, and manufacturing method of same

1. An array substrate comprising a display region and a non-display region surrounding the display region, wherein the display region comprises:

a thin film transistor structure layer comprising a gate electrode layer and a source drain electrode layer, wherein the gate electrode layer and the source drain electrode layer are made of an alloy material comprising one or a group selected from Al, Ge, Nd, Ta, Zr, Ni, or La;

the non-display region comprises a binding region and a fan out region disposed between the binding region and the display region, and the display region comprises a main display region and an auxiliary region disposed between the main display region and the fan out region

wherein the thin film transistor structure layer comprises:

a substrate extending from the display region to the non-display region;

a barrier layer formed on the substrate and extending from the display region to the non-display region;

a buffer layer formed on the barrier layer and extending from the display region to the non-display region;

an active layer formed on the buffer layer of the main display region; and

a first insulating layer formed on the buffer layer, covering the active layer, and extending to the non-display region;

wherein the gate electrode layer comprises a first gate electrode layer and a second gate electrode layer; and

the first gate electrode layer is formed on the first insulating layer;

a second insulating layer formed on the first insulating layer, covering the first gate electrode layer, and extending to the non-display region;

wherein the second gate electrode layer is formed on the second insulating layer; and

a third insulating layer formed on the second insulating layer, covering the second gate electrode layer, and extending to the non-display region;

wherein the source drain electrode layer comprises:

a first source drain electrode layer formed on the third insulating layer of the main display region and penetrating through the third insulating layer, the second insulating layer, and the first insulating layer to connect the active layer;

a planarization layer formed on the third insulating layer, covering the source drain electrode layer, and extending to the non-display region;

a second source drain electrode layer formed on the third insulating layer of the auxiliary region, penetrating through the third insulating layer to correspondingly connect to the fourth metal section; and

a third source drain electrode layer formed on the third insulating layer of the fan out region, wherein the third source drain electrode layer is connected to the second metal section and the fifth metal section of the fan out region.

2. The array substrate of claim 1 , wherein a hole is disposed in the binding region, the hole penetrates through the first insulating layer, the second insulating layer, the third insulating layer, and the planarization layer, the hole comprises a bottom surface, the bottom surface attaches the substrate.

3. The array substrate of claim 2 further comprises:

an anode layer formed on the planarization layer of the main display region, penetrating through the planarization layer, and connected to the first source drain electrode layer;

a pixel defining layer formed on the planarization layer, covering the anode layer, and extending to the non-display region, a light emitting hole is disposed in the pixel defining layer and corresponds to the anode layer, the light emitting hole comprises a bottom surface, the bottom surface is defined at one side of the anode layer far away from the planarization layer; and

an organic layer filled into the hole, wherein one side of the organic layer far away from the hole is aligned over one side of the third insulating layer near the planarization layer.

4. The array substrate of claim 1 , wherein the first gate electrode layer comprises:

a first metal section disposed in the main display region and corresponding to the active layer; and

a second metal section extending from the fan out region to the binding region and covering an inside surface of the hole;

the second gate electrode layer comprises:

a third metal section disposed in the main display region and corresponding to the active layer;

a fourth metal section disposed on the second insulating layer of the auxiliary region; and

a fifth metal section disposed on second insulating layer of the fan out region, wherein a projection shape of the second gate electrode layer projected on the substrate is a mesh structure, the mesh structure comprises a plurality of hollow out areas and a wirings area surrounding the plurality of the hollow out areas.

5. A manufacturing method of an array substrate, wherein the array substrate comprises a display region, and further comprises a non-display region surrounding the display region, the non-display region comprises a binding region and a fan out region disposed between the binding region and the display region, the display region comprises a main display region and an auxiliary region disposed between the main display region and the fan out region, the fan out region is disposed between the display region and the binding region, wherein the method comprises:

a step S 1 ) of forming a thin film transistor structure layer, wherein the thin film transistor structure layer comprising a gate electrode layer and a source drain electrode layer, wherein the gate electrode layer and the source drain electrode layer are made of an alloy material comprising one or a group selected from Al, Ge, Nd, Ta, Zr, Ni, or La;

a step S 2 ) of disposing a through hole in the planarization layer corresponding to the first source drain electrode layer, and depositing an anode layer on the planarization layer, wherein the anode layer is connected to the first source drain electrode layer by the through hole;

a step S 3 ) of depositing a pixel defining layer on the planarization layer, wherein the pixel defining layer covers the anode layer;

a step S 4 ) of disposing a light emitting hole in the pixel defining layer corresponding to a region of the anode layer, wherein a bottom surface of the light emitting hole is totally on the anode layer;

wherein the step S 1 ) comprises:

a step S 101 ) of providing a substrate;

a step S 102 ) of depositing a barrier layer on the barrier layer;

a step S 103 ) of depositing a buffer layer on the barrier layer;

a step S 104 ) of depositing a first insulating layer on the buffer layer of the main display region, wherein the first insulating layer covers the active layer and extends to the non-display region;

a step S 105 ) of forming a first gate electrode layer on the first insulating layer;

a step S 106 ) of depositing a second insulating layer on the first insulating layer, wherein the second insulating layer covers the first gate electrode layer and extends to the non-display region;

a step S 107 ) of forming a second gate electrode layer on the second insulating layer;

a step S 108 ) of depositing a third insulating layer on the second insulating layer, wherein the third insulating layer covers the second gate electrode layer and extends to the non-display region;

a step S 109 ) of employing a hole etching process to the third insulating layer, the second insulating layer, and the first insulating layer, a layer of a first source drain electrode layer is formed on the third insulating layer of the main display region, the first source drain electrode layer penetrates through the hole disposed in the third insulating layer, the second insulating layer, and the first insulating layer to connect to the active layer; and

a step S 110 ) of forming a planarization layer on the third insulating layer and extending to the non-display region, wherein the planarization layer covers the source drain electrode layer; and

wherein the step S 105 ) comprises:

forming a first metal section on the first insulating layer of the main display region, wherein the first metal section corresponds to the active layer; and

forming a second metal section on the first insulating layer from the fan out region to the binding region, wherein the second metal section covers an inside surface of the hole from the first insulating layer;

wherein in the step S 107 ) comprises:

forming a third metal section on the second insulating layer of the display region, wherein the third metal section corresponds to the first metal section;

forming a fourth metal section on the second insulating layer of the auxiliary region; and

forming a fifth metal section on the second insulating layer of the fan out region;

wherein the step S 109 ) comprises: etching the binding region to form a hole;

wherein the hole penetrates through the first insulating layer, the buffer layer, and the barrier layer to make a bottom surface of the hole attach the substrate, and an organic matter is filled into the hole to form an organic layer; and

wherein one side of the organic layer far away from the hole is aligned over one side of the third insulating layer near the planarization layer.