IP Library Granted Patent US 11,476,312
Granted Patent B2
US 11,476,312 · App. 16/641,754 · Granted Oct 18, 2022

Display substrate comprising fingerprint recognition sensors, method for manufacturing the same, and display device

Inventors: Mingchun Qi (Beijing, CN); Mengxia Kong (Beijing, CN); Xuwu Hu (Beijing, CN); Donghui Si (Beijing, CN)
Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
H01L27/3225G06V40/1306H01L27/20H01L27/3246H01L51/56H01L2227/323
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Quick Facts
Patent No.
US 11,476,312
App. No.
16/641,754
Granted
Oct 18, 2022
Kind
B2
Abstract

Embodiments of the present disclosure relate to a display substrate, a method for manufacturing the same, and a display device. The display substrate includes a substrate, a pixel definition layer for defining pixels on the substrate, the pixel definition layer including a plurality of inter-pixel portions located between adjacent pixels, and a fingerprint recognition sensor located in the inter-pixel portions.

Claims (27)

1. A method for manufacturing a display substrate comprising:

providing a substrate;

forming a pixel definition layer for defining pixels on the substrate, wherein each pixel comprises a light emitting device; and

forming the light emitting devices on the substrate and in the pixel definition layer, the pixel definition layer comprising a plurality of inter-pixel portions located between adjacent light emitting devices,

wherein forming the pixel definition layer comprises forming a fingerprint recognition sensor in at least one of the inter-pixel portions, and

wherein the fingerprint recognition sensor is an ultrasonic fingerprint recognition sensor, wherein the ultrasonic fingerprint recognition sensor comprises a generator and a receiver, wherein forming the ultrasonic fingerprint recognition sensor comprises positioning the generator and the receiver in different inter-pixel portions, the inter-pixel portion comprising a first inter-pixel portion and a second inter-pixel portion located on opposite sides of each pixel, and wherein forming the first inter-pixel portion, the second inter-pixel portion, and the ultrasonic fingerprint recognition sensor comprises:

forming a first lower electrode in a region for forming the first inter-pixel portion on the substrate, and forming a second lower electrode in a region for forming the second inter-pixel portion on the substrate;

forming a first portion of the first inter-pixel portion covering the substrate and the first lower electrode in the region for forming the first inter-pixel portion, and forming a first portion of the second inter-pixel portion covering the substrate and the second lower electrode in the region for forming the second inter-pixel portion;

forming a first hole exposing the first lower electrode in the first portion of the first inter-pixel portion, and forming a second hole exposing the second lower electrode in the first portion of the second inter-pixel portion;

forming a first piezoelectric material in the first hole, and forming a second piezoelectric material in the second hole;

forming a first upper electrode on the first portion of the first inter-pixel portion and the first piezoelectric material, and forming a second upper electrode on the first portion of the second inter-pixel portion and the second piezoelectric material; and

forming a second portion of the first inter-pixel portion on the first upper electrode and the first portion of the first inter-pixel portion, and forming a second portion of the second inter-pixel portion on the second upper electrode and the first portion of the second inter-pixel portion.

2. The method according to claim 1 , wherein forming the first lower electrode and the second lower electrode comprises:

forming a first conductive layer on the substrate; and

patterning the first conductive layer to form the first lower electrode in the region for forming the first inter-pixel portion and to form the second lower electrode in the region for forming the second inter-pixel portion,

and wherein forming the first upper electrode and the second upper electrode comprises:

forming a second conductive layer covering the first portion of the first inter-pixel portion and the first piezoelectric material and covering the first portion of the second inter-pixel portion and the second piezoelectric material; and

patterning the second conductive layer to form the first upper electrode on the first portion of the first inter-pixel portion and the first piezoelectric material and to form the second upper electrode on the first portion of the second inter-pixel portion and the second piezoelectric material.

3. The method according to claim 2 , wherein forming each light emitting device comprises:

forming an anode on the substrate, wherein the anode is formed simultaneously with the first lower electrode and the second lower electrode;

forming a light emitting layer on the anode; and

forming a cathode on the light emitting layer and the pixel definition layer.

4. The method according to claim 3 , further comprising:

forming a TFT layer on the substrate before forming the pixel definition layer and the fingerprint recognition sensor;

forming a planarization layer on the TFT layer;

forming an encapsulation layer on the cathode after forming the cathode; and

forming a touch layer on the encapsulation layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 28, 2022
From: BOE TECHNOLOGY GROUP CO., LTD.
To: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
Reel/Frame 060656/0689 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2020
From: QI, MINGCHUN; KONG, MENGXIA; HU, XUWU; SI, DONGHUI
To: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 051916/0976 →
Continuity (1)
Related Publication 20210151522A1 · May 20, 2021