Power module with integrated cooling device
An electric device, comprising: a power module having a circuit carrier on which a circuit component is disposed; a cooling structure; and an intermediate structure disposed between the circuit carrier and the cooling structure, wherein the cooling structure is made of a first metal material, and the intermediate structure is made of a second metal material having a higher thermal conductivity than that of the first metal material.
1. An electric device, comprising:
a power module having a circuit carrier on which a circuit component is disposed;
a cooling structure; and
an intermediate structure disposed between the circuit carrier and the cooling structure,
wherein the cooling structure is made of a first metal material, and the intermediate structure is made of a second metal material having a higher thermal conductivity than that of the first metal material, and
wherein the cooling structure comprises:
a first plate-shaped body; and
a second plate-shaped body disposed opposite to the first plate-shaped body,
wherein the first plate-shaped body is formed on a surface thereof facing the second plate-shaped body with a first protruding structure, the second plate-shaped body is formed on a surface thereof facing the first plate-shaped body with a second protruding structure, and the first and second protruding structures form a fluid flow channel, and
wherein the first protruding structure comprises a first wall extending in a first direction and a plurality of second walls extending towards the second protruding structure, the second protruding structure comprises a first wall extending in the first direction and a plurality of second walls extending towards the first protruding structure, and the second walls of the first protruding structure and the second walls of the second protruding structure are alternately arranged in the first direction, such that the fluid flow channel is tortuous.
2. The electric device according to claim 1 , wherein the cooling structure is connected directly to the intermediate structure.
3. The electric device according claim 1 , wherein the intermediate structure is directly connected to the circuit carrier.
4. The electric device according to claim 1 , wherein the second metal material has a coefficient of thermal expansion lower than that of the first metal material.
5. The electric device according claim 1 , wherein the cooling structure is made of aluminum, and wherein the intermediate structure comprises a copper-based structure.
6. The electric device according to claim 5 , wherein the copper-based structure comprises a copper plate.
7. The electric device according to claim 5 , wherein a thickness of the copper-based substrate is in a range from 25 μm to 5 mm.
8. The electric device according to claim 1 , wherein the intermediate structure is bonded to the bottom surface of the circuit carrier through soldering or low pressure silver sintering.
9. The electric device according to claim 1 , wherein the circuit carrier comprises any one of substrate, a direct copper bonded plate and a printed circuit board.
10. The electric device according to claim 1 , wherein a top end of the first protruding structure is bonded to the second plate-shaped body in a fluid-tight manner by welding or brazing, and a top end of the second protruding structure is bonded to the first plate-shaped body in a fluid-tight manner by welding or brazing.
11. The electric device according to claim 10 , wherein the welding or brazing comprises active metal brazing.
12. The electric device according to claim 1 , wherein the second walls of the first protruding structure are equidistantly spaced apart by a distance of about 5.2 mm, the second walls of the second protruding structure are equidistantly spaced apart by a distance of about 5.2 mm, a thickness of each of the second walls of the first and the second protruding structures is about 1.2 mm.
13. A method of manufacturing the electric device, recited in claim 1 , comprising the steps of:
supplying the first plate-shaped body,
forming the first protruding structure on a surface of the first plate-shaped body,
supplying the second plate-shaped body,
forming the second protruding structure on a surface of the second plate-shaped body,
bonding the top end of the first protruding structure to the second plate-shaped body in a fluid-tight manner by welding or brazing, and
bonding the top end of the second protruding structure to the first plate-shaped body in a fluid-tight manner by welding or brazing,
whereby the first and second protruding structures form a fluid flow channel.
14. The method of manufacturing the electric device according to claim 13 whereby the welding or brazing comprises active metal brazing.
15. The method of manufacturing the electric device according to claim 14 comprising the additional step of supplying one or more preforms to enable the welding or brazing process.
16. The method of manufacturing the electric device according to claim 13 in which at least one of the first protruding structures or the second protruding structures are formed by forging.