IP Library Granted Patent US 11,346,895
Granted Patent B2
US 11,346,895 · App. 16/645,639 · Granted May 31, 2022

Method of manufacturing magnetic sensor and magnetic sensor assembly

Inventor: Daizo Endo (Ichihara, JP)
Assignee: SHOWA DENKO K.K.
G01R33/02C23C14/06C23C14/35H01F10/08H01F41/32
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Quick Facts
Patent No.
US 11,346,895
App. No.
16/645,639
Granted
May 31, 2022
Kind
B2
Abstract

A method of manufacturing a magnetic sensor includes: a soft magnetic material layer deposition process depositing a soft magnetic material layer ( 101 ) constituting a sensitive part ( 21 ) sensing a magnetic field on a substrate ( 10 ) by magnetron sputtering; and a sensitive part formation process forming the sensitive part ( 21 ) sensing the magnetic field in a portion of the soft magnetic material layer ( 101 ) where uniaxial magnetic anisotropy is provided by a magnetic field used for magnetron sputtering of the soft magnetic material layer ( 101 ).

Claims (9)

1. A method of manufacturing a magnetic sensor array, the method comprising:

a soft magnetic material layer deposition process depositing a soft magnetic material layer on a substrate by magnetron sputtering, the soft magnetic material layer constituting a sensitive part sensing a magnetic field; and

a sensitive part formation process forming the sensitive part sensing the magnetic field in a portion of the soft magnetic material layer where uniaxial magnetic anisotropy is provided by a magnetic field used for the magnetron sputtering,

wherein the magnetron sputtering is performed in a plane facing a surface of the substrate by use of a cathode in which a magnetic circuit forming a magnetic field rotates, and

wherein the magnetic circuit is arranged concentrically with respect to the substrate and a shorter side of the sensitive part is formed to be parallel to a diameter direction of the substrate, and

wherein the magnetic sensor array comprises a plurality of magnetic sensors, each including a sensitive part sensing a magnetic field, arranged concentrically with respect to the substrate.

2. The method of manufacturing a magnetic sensor array according to claim 1 , wherein, in the sensitive part formation process, the sensitive part having a longer side and a shorter side is formed to be placed such that the shorter side direction is in a direction of the uniaxial magnetic anisotropy.

3. The method of manufacturing a magnetic sensor array according to claim 1 , wherein the soft magnetic material layer deposition process and the sensitive part formation process are performed on a substrate provided with a thin film magnet configured with a hard magnetic material forming a magnetic field in a direction intersecting the direction of the uniaxial magnetic anisotropy of the sensitive part.

4. The method of manufacturing a magnetic sensor array according to claim 2 , wherein the soft magnetic material layer deposition process and the sensitive part formation process are performed on a substrate provided with a thin film magnet configured with a hard magnetic material forming a magnetic field in a direction intersecting the direction of the uniaxial magnetic anisotropy of the sensitive part.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2020
From: ENDO, DAIZO
To: SHOWA DENKO K.K.
Reel/Frame 052055/0177 →