Thermally conductive insulating sheet, and composite member
The present invention provides a thermally conductive insulating sheet having appropriate fluidity upon being heated and pressurized, and free from of the possibility of a material leaking to the outside beyond the original size of the sheet. The thermally conductive insulating sheet according to the present invention contains an uncured material and/or a semi-cured material of a binder resin (R) which is a thermosetting resin. In the present invention, a complex viscosity in a temperature range of 100-200° C. is 10,000-150,000 Pa·s, a ratio (α/β) of the maximum value (α) to the minimum value (β) of the complex viscosity in said temperature range is 1.0-4.0, and the flow value is 90-100%. Flow value(%)=W2/W1×100.
1. A thermally conductive insulating sheet which includes an uncured and/or semi-cured binder resin (R) material which is a thermosetting resin, and the thermally conductive insulating sheet comprises a plurality of layers (A) and one or more layers (B),
wherein a complex viscosity of the thermally conductive insulating sheet in a temperature range of 100° C. to 200° C. is 10,000 Pa·s to 150,000 Pa·s, a ratio (α/β) of a maximum value (α) to a minimum value (β) of the complex viscosity of the thermally conductive insulating sheet in this temperature range is 1.0 to 4.0, and a flow value of the thermally conductive insulating sheet defined by the following Formula (1) is 90% to 100%:
Flow value (%)= W 2 /W 1×100 (1)
in Formula (1), reference numerals indicate the following parameters
W1 is a mass of a 50 mm-square thermally conductive insulating sheet, and
W2 is a mass of a 50 mm-square heated and pressed product of a thermally conductive insulating sheet obtained by heating and pressurizing the 50 mm-square thermally conductive insulating sheet under conditions of 150° C. and 1 MPa for 60 minutes,
wherein the thermally conductive insulating sheet further includes a thermally conductive insulating filler (F) comprising a thermally conductive spherical filler (F1) excluding boron nitride and a boron nitride filler (F2),
the boron nitride filler (F2) is an aggregate of boron nitride having an average compressive force of 5 mN or less required for a compression deformation ratio of 10%,
in each of the plurality of layers (A), an amount of the thermally conductive spherical filler (F1) is larger than an amount of the boron nitride filler (F2),
in each of the one or more layers (B), an amount of the boron nitride filler (F2) is larger than an amount of the thermally conductive spherical filler (F1), and
the plurality of layers (A) and the one or more layers (B) are alternately laminated and the layer (B) does not become the outermost layer.
2. The thermally conductive insulating sheet according to claim 1 ,
wherein the complex viscosity of the thermally conductive insulating sheet in this temperature range of 100° C. to 200° C. is 27,000 Pa·s to 100,000 Pa·s, the ratio (α/β) of the maximum value (α) to the minimum value (β) of the complex viscosity of the thermally conductive insulating sheet in this temperature range is 1.0 to 2.5, and the flow value of the thermally conductive insulating sheet is 95% to 100%.
3. The thermally conductive insulating sheet according to claim 2 ,
wherein the binder resin (R) is at least one selected from among a thermosetting polyurethane resin, a thermosetting acrylic resin, and a thermosetting polyamide resin.
4. A composite member in which a heat dissipation base substrate is adhered to at least one surface of a heat generating member including a heat generating part that is able to generate heat via a thermally conductive insulating film comprising a cured material of a binder resin (R), which is formed of a heated and pressed product of the thermally conductive insulating sheet according to claim 2 .
5. The composite member according to claim 4 ,
wherein the thermally conductive insulating film has a porosity of 0.3 or less.
6. The composite member according to claim 4 ,
wherein the heat generating member includes a power semiconductor element.
7. The thermally conductive insulating sheet according to claim 1 ,
wherein the binder resin (R) is at least one selected from among a thermosetting polyurethane resin, a thermosetting acrylic resin, and a thermosetting polyamide resin.
8. A composite member in which a heat dissipation base substrate is adhered to at least one surface of a heat generating member including a heat generating part that is able to generate heat via a thermally conductive insulating film comprising a cured material of a binder resin (R), which is formed of a heated and pressed product of the thermally conductive insulating sheet according to claim 1 .
9. The composite member according to claim 8 ,
wherein the thermally conductive insulating film has a porosity of 0.3 or less.
10. The composite member according to claim 8 ,
wherein the heat generating member includes a power semiconductor element.