UV curable silicone adhesive composition and cured product thereof
This composition contains (A) 100 parts of an organopolysiloxane having two groups represented by general formula (1) (R 1 represents a monovalent hydrocarbon group having 1-20 carbon atoms, R 2 represents an oxygen atom or the like, R 3 represents an acryloyloxyalkyl group or the like, p represents a number satisfying 0≤p≤10, and “a” represents a number satisfying 1≤a≤3) per molecule, (B) 1-500 parts of a monofunctional (meth)acrylate compound not containing a siloxane structure, (C) 1-5,000 parts of an organopolysiloxane resin containing (a) an R 4 3 SiO 1/2 unit (in the formula, R 4 represents a monovalent hydrocarbon group having 1-10 carbon atoms) and (b) a SiO 4/2 unit, where the molar ratio of the unit (a) to the unit (b) is in the range of 0.6 to 1.2:1, (D) 1-100 parts of fine powder silica, and (E) 0.01-20 parts of an optical polymerization initiator. The compound has good shape retention properties and curability for irradiation with ultraviolet light, and provides a cured product which has excellent adhesion suitable for a temporary fixing material.
1. A UV cure type silicone pressure-sensitive adhesive composition comprising:
(A) 100 parts by weight of an organopolysiloxane having, in the molecule, two groups of the following general formula (1) and a backbone consisting essentially of repeating diorganosiloxane units, wherein the number of the repeating diorganosiloxane units is 1 to 600:
wherein R 1 is each independently a C 1 -C 20 monovalent hydrocarbon group, R 2 is oxygen or a C 1 -C 20 alkylene group, R 3 is an acryloyloxyalkyl, methacryloyloxyalkyl, acryloyloxyalkyloxy or methacryloyloxyalkyloxy group, p is a number in the range: 0≤p≤10, and a is a number in the range: 1≤a≤3,
(B) 1 to 500 parts by weight of a monofunctional (meth)acrylate compound free of siloxane structure,
(C) 1 to 5,000 parts by weight of an organopolysiloxane resin composed of (a) R 4 3 SiO 1/2 units wherein R 4 is a C 1 -C 10 monovalent hydrocarbon group and (b) SiO 4/2 units, a molar ratio of (a) units to (b) units being in the range of from 0.6/1 to 1.2/1,
(D) 1 to 100 parts by weight of finely divided silica, and
(E) 0.01 to 20 parts by weight of a photopolymerization initiator.
2. The UV cure type silicone pressure-sensitive adhesive composition of claim 1 wherein a ratio (AB) of viscosity A at 23° C. and a rotational speed of 2 rpm to viscosity B at 23° C. and a rotational speed of 10 rpm, that is, thixotropic index is from 1.1 to 10.
3. The UV cure type silicone pressure-sensitive adhesive composition of claim 1 wherein a viscosity B at a rotational speed of 10 rpm is in the range of 10 to 5,000 Pa·s.
4. A cured product of the UV cure type silicone pressure-sensitive adhesive composition of claim 1 .
5. A pressure-sensitive adhesive comprising the cured product of claim 4 .
6. A pressure-sensitive adhesive sheet comprising the cured product of claim 4 .
7. A microstructure transfer stamp comprising the cured product of claim 4 .
8. The microstructure transfer stamp of claim 7 , having at least one protrusion.
9. A microstructure transfer apparatus comprising the microstructure transfer stamp of claim 7 .