Curable organopolysiloxane composition, and pattern forming method
Provided are a curable organopolysiloxane composition, and a pattern forming method using the curable organopolysiloxane composition. The curable organopolysiloxane composition generally has hydrosilylation reaction curing properties, may be precisely applied using, for example, a jet dispenser, and has a viscosity at a strain rate of 1,000 (1/s) of 2.0 Pa·s or less, and a viscosity at a strain rate of 0.1 (1/s) of at least 50.0 times the viscosity at a strain rate of 1,000 (1/s). The curable organopolysiloxane composition has rheological properties suitable for precision application and micropattern formation using a microdroplet coating device such as a jet dispenser.
1. A curable organopolysiloxane composition, comprising:
(A) an alkenyl group-containing organopolysiloxane having a viscosity at 25° C. of from 10 to 100,000 mPa·s in an amount of 100 parts by mass;
(B) an organohydrogenpolysiloxane in an amount such that there are from 0.2 to 5 mol silicon-bonded hydrogen atoms in component (B) per mol of alkenyl groups in component (A);
(C) a hydrosilylation reaction catalyst in a catalytic amount;
(D) a functional filler with an average particle size of from 0.01 to 10 μm as measured by a laser diffraction/scattering method in an amount of from 2.5 to 20.0 parts by mass;
(E) an adhesion promoter; and
(F) a hydrosilylation reaction inhibitor;
wherein the viscosity at a strain rate of 1,000 (1/s) is 2.0 Pa·s or less and the viscosity at a strain rate of 0.1 (1/s) is at least 50.0 times the viscosity at a strain rate of 1,000 (1/s).
2. The curable organopolysiloxane composition according to claim 1 , wherein the viscosity at a strain rate of 1,000 (1/s) is 1.5 Pa·s or less and the viscosity at a strain rate of 0.1 (1/s) is at least 50 Pa·s.
3. The curable organopolysiloxane composition according to claim 1 , wherein component (D) has at least (D1) a reinforcing filler with an average primary particle size of from 0.01 to 0.5 μm.
4. The curable organopolysiloxane composition according to claim 1 , wherein component (F) is a mixture of (F1) an acetylene-based hydrosilylation inhibitor and (F2) a cycloalkenylsiloxane-based hydrosilylation reaction inhibitor.
5. The curable organopolysiloxane composition according to claim 1 further comprising (G) a heat resistance imparting agent.
6. The curable organopolysiloxane composition according to claim 1 , wherein the curable organopolysiloxane composition is a one-part curable organopolysiloxane composition.
7. An article formed from the curable organopolysiloxane composition according to claim 6 .
8. The curable organopolysiloxane composition according to claim 1 , wherein the curable organopolysiloxane composition is a one-part curable organopolysiloxane composition adapted for application via a microdroplet application device.
9. The curable organopolysiloxane composition according to claim 8 , wherein the microdroplet application device is a jet dispenser.
10. A pattern forming method, the method comprising applying the curable organopolysiloxane composition according to claim 1 on a substrate using a microdroplet application device.
11. The pattern forming method according to claim 10 , wherein a microdroplet application device having a nozzle diameter of 1000 μm or less is used for a pattern including at least an application area whose shape fits within a frame having a length and width of 1000 μm or a linear application area having a line width of 1000 μm or less, or a combination thereof.
12. The pattern forming method according to claim 10 , wherein the microdroplet application device is a jet dispenser.
13. A pattern forming method, the method comprising applying a curable organopolysiloxane composition on a substrate using a microdroplet application device, wherein the viscosity of the curable organopolysiloxane composition at a strain rate of 1,000 (1/s) is 2.0 Pa·s or less and the viscosity of the curable organopolysiloxane composition at a strain rate of 0.1 (1/s) is at least 50.0 times the viscosity at a strain rate of 1,000 (1/s).
14. The pattern forming method according to claim 13 , wherein a microdroplet application device having a nozzle diameter of 1000 μm or less is used for a pattern including at least an application area whose shape fits within a frame having a length and width of 1000 μm or a linear application area having a line width of 1000 μm or less, or a combination thereof.
15. The pattern forming method according to claim 13 , wherein the microdroplet application device is a jet dispenser.