IP Library › Granted Patent US 11,446,902
Granted Patent B2
US 11,446,902 · App. 16/647,285 · Granted Sep 20, 2022

Packaging material for molding, exterior case for electricity storage device and electricity storage device

Inventors: Kenji Yoshino (Kanagawa, JP); Yuji Minamibori (Kanagawa, JP); Katsumi Tanaka (Kanagawa, JP)
Assignee: SHOWA DENKO PACKAGING CO., LTD.
B32B15/09B32B7/12B32B15/20B32B27/36C09J175/06H01M50/10B32B37/12B32B37/16B32B38/0036B32B2037/1253B32B2250/03B32B2250/04B32B2307/31B32B2307/50B32B2307/546B32B2307/708B32B2311/24B32B2367/00B32B2439/40B32B2457/10B65D65/40C09J175/04C09J2203/33H01G11/78H01M50/105H01M50/116H01M50/119H01M50/121H01M50/124H01M50/126H01M50/129H01M50/131Y10T428/1355Y10T428/1359Y10T428/1376Y10T428/1383Y10T428/31565Y10T428/31605Y10T428/31681Y10T428/31786
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Quick Facts
Patent No.
US 11,446,902
App. No.
16/647,285
Granted
Sep 20, 2022
Kind
B2
Abstract

Provided is a molding packaging material capable of sealing without causing sealing failure, significantly reducing cleaning frequency of a seal bar to improve productivity, and preventing occurrence of delamination. The molding packaging material includes a PBT terephthalate (PBT) layer 2 , a heat fusible resin layer 3 , and a metal foil layer 4 between the two layers. The PBT layer 2 and the metal foil layer 4 are bonded via an outer adhesive layer 5 . The outer adhesive layer 5 is formed of a urethane adhesive cured film composed of a polyester polyol, a polyfunctional isocyanate compound, and polyhydric alcohol. The polyester polyol contains a dicarboxylic acid component, the dicarboxylic acid component includes an aromatic dicarboxylic acid. The dicarboxylic acid component contains an aromatic dicarboxylic acid. The content rate of the aromatic dicarboxylic acid in the dicarboxylic acid component is 40 mol % to 80 mol %. The Young's modulus of the cured film of the urethane adhesive is 70 MPa to 400 MPa. The PBT layer has tensile strength of 100 MPa to 300 MPa.

Claims (30)

1. A molding packaging material comprising:

a polybutylene terephthalate layer consisting of a polybutylene terephthalate resin only as an outer layer;

a heat fusible resin layer as an inner layer; and

a metal foil layer arranged between the polybutylene terephthalate layer and the heat fusible resin layer,

wherein the polybutylene terephthalate layer and the metal foil layer are bonded via an outer adhesive layer,

wherein the outer adhesive layer is formed of a cured film of a urethane adhesive containing polyester polyol, a polyfunctional isocyanate compound, and a polyhydric alcohol,

wherein the polyester polyol contains a dicarboxylic acid component,

wherein the dicarboxylic acid component contains aromatic dicarboxylic acid, and a content rate of the aromatic dicarboxylic acid in the dicarboxylic acid component is 40 mol % to 80 mol %,

wherein Young's modulus of the cured film of the urethane adhesive is 170 MPa to 240 MPa,

wherein tensile strength of the polybutylene terephthalate layer is 180 MPa to 190 MPa in a MD direction and 180 MPa to 190 MPa in a TD direction, and

wherein a number average molecular weight of the polyester polyol is in a range of 8,000 to 30,000.

2. The molding packaging material as recited in claim 1 ,

wherein the number average molecular weight of the polyester polyol is in a range of 10,000 to 26,000.

3. The molding packaging material as recited in claim 1 ,

wherein the outer adhesive layer includes at least one bond selected from the group consisting of a urethane bond, an ester bond, a urea bond, an allophanate bond, a biuret bond, and an amide bond.

4. The molding packaging material as recited in claim 1 ,

wherein in the urethane adhesive, a ratio (equivalence ratio) of a mol number of an isocyanate group of the polyfunctional isocyanate compound to a mol number of a hydroxyl group of the polyester polyol is 2 to 25.

5. A power storage device packaging case composed of a molded article of the molding packaging material as recited in claim 1 .

6. A power storage device comprising:

a power storage device main parts; and

a packaging member comprising at least the power storage device packaging case as recited in claim 5 ,

wherein the power storage device main parts is packaged with the packaging member.

7. A method of producing a molding packaging material according to claim 1 , comprising:

a process of preparing a laminate comprising a polybutylene terephthalate layer consisting of a polybutylene terephthalate resin only as an outer layer, a heat fusible resin layer as an inner layer, and a metal foil layer arranged between the polybutylene terephthalate layer and the heat fusible resin layer, wherein the polybutylene terephthalate layer is formed of a polybutylene terephthalate film having tensile strength of 180 MPa to 190 MPa in an MD direction and 180 MPa to 190 MPa in a TD direction, the heat fusible resin layer and the metal foil layer are bonded via a curing type inner adhesive, and the polybutylene terephthalate layer and the metal foil layer are bonded via a curing type outer adhesive containing polyester polyol, a polyfunctional isocyanate compound, and a polyhydric alcohol; and

an aging treatment process of curing the curing type inner adhesive and the curing type outer adhesive by subjecting the laminate to a heat aging treatment at a temperature of 37° C. to 55° C.,

wherein the polyester polyol contains a dicarboxylic acid component,

wherein the dicarboxylic acid component contains aromatic dicarboxylic acid, and

wherein a content rate of the aromatic dicarboxylic acid in the dicarboxylic acid component is 40 mol % to 80 mol %.

8. The molding packaging material as recited in claim 1 , wherein tensile strength of the polybutylene terephthalate layer is 190 MPa in a MD direction and 180 MPa in a TD direction.

9. The method of producing a molding packaging material according to claim 8 , wherein the polybutylene terephthalate layer is formed of a polybutylene terephthalate film having tensile strength of 190 MPa in an MD direction and 180 MPa in a TD direction.

Assignments (2)
CHANGE OF NAME Recorded Dec 21, 2023
From: SHOWA DENKO PACKAGING CO., LTD.
To: RESONAC PACKAGING CORPORATION
Reel/Frame 066089/0675 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 13, 2020
From: YOSHINO, KENJI; MINAMIBORI, YUJI; TANAKA, KATSUMI
To: SHOWA DENKO PACKAGING CO., LTD.
Reel/Frame 052110/0151 →
Priority Claims (1)
JP JP2017-176419 · Sep 14, 2017 · national
Continuity (1)
Related Publication 20200215795A1 · Jul 9, 2020