Circuit board
The circuit board according to the present invention includes a wiring portion and a non-wiring portion, the wiring portion having a metal layer and a resin layer, the non-wiring portion having a resin layer, the resin layer at a frequency 10 GHZ having a relative permittivity of from 2 to 3 at 23° C., and the circuit hoard satisfying a relationship: (A−B)/B≤0.1 wherein A is the maximum value of the thickness in the wiring portion (μm) and B is the minimum value of the thickness in the non-wiring portion (μm).
1. A circuit board, comprising:
a wiring portion and
a non-wiring portion,
wherein the wiring portion comprises a metal layer and a resin layer,
the non-wiring portion comprises the resin layer,
the wiring portion is a portion of the metal layer formed on a substrate and the resin layer laminated on the metal layer in the +Z direction,
the non-wiring portion is a portion of the resin layer other than the wiring portion,
the resin layer comprises a polymer having a repeating unit represented by at least one of the following formulas (1-1), (1-2) and (1-3), and a repeating unit represented by the following formula (2), a curable compound, and a curing aid,
the resin layer at a frequency 10 GHz has a relative permittivity of from 2 to 3 at 23° C., and
the circuit board satisfies a relationship:
( A−B )/ B≤ 0.1,
wherein A is a maximum value of a thickness in the wiring portion (μm) and B is a minimum value of a thickness in the non-wiring portion (μm)
wherein in the formulae (1-1) to (1-3), R 1 are each independently a halogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a monovalent halogenated hydrocarbon group having 1 to 20 carbons, a nitro group, a cyano group, a primary to tertiary amino group, or a salt of a primary to tertiary amino group, n is each independently an integer of 0 to 2 and wherein when n is 2, the plurality of R 1 s is may be the same or different, and may bond in any combination to form part of a ring structure,
wherein in the formula (2), R 3 and R 4 are each independently a halogen atom, a nitro group, a cyano group, or a monovalent hydrocarbon group or halogenated hydrocarbon group having from 1 to 20 carbon atoms, c and d are each independently an integer from 0 to 8, e, f, and y are each independently an integer of 0 to 2, and L is a single bond, —O—, —S—, —CO—, —SO—, —SO 2 —, or a divalent organic group having from 1 to 20 carbon atoms.
2. The circuit board according to claim 1 , wherein the metal layer and the resin layer in the wiring portion are in direct contact with each other.
3. The circuit board according to claim 1 , wherein a dielectric loss tangent of the resin layer at a frequency 10 GHz is from 0.001 to 0.01 at 23° C.
4. The circuit board according to claim 1 , wherein the resin layer has an elastic modulus of from 0.1 to 3 GPa.
5. The circuit board according to claim 1 , wherein a peel strength between the resin layer and the metal layer is 5 N/cm or greater.
6. The circuit board according to claim 1 , wherein a thickness of the resin layer is from 10 to 100 μm, and a thickness of the metal layer is from 10 to 50 μm.