Interconnecting circuit board to stretchable wires

1. An interconnect between a stretchable electronic element and an electronic circuit, the stretchable electronic element operable to be mechanically coupled to a substrate which deforms, the stretchable electronic element remaining functionally operable when the substrate is deformed, and the stretchable electronic element comprising one or more electrical pathways; the electronic circuit configured to electronically communicate with the stretchable electronic element and comprising at least one circuit board; wherein the interconnect comprises an electrical coupling between the electrical pathways of the stretchable electronic element and the circuit board of the electronic circuit, and wherein

the stretchable electronic element includes a sensor, the sensor mechanically coupled to the substrate which deforms and operable to change an electrical characteristic to instrument deformation of the substrate, the sensor including one or more of the electrical pathways; and

the circuit board is configured to form part of an electrical circuit including the sensor.

2. An interconnect as claimed in claim 1 , wherein the interconnect comprises an electrical conductor extending normal to the surface of the electrical pathways of the stretchable electronic element, the electrical conductor including the electrical coupling between the electrical pathways of the stretchable electronic element and the circuit board.

3. An interconnect as claimed in claim 1 , wherein the interconnect comprises landing pads disposed between the electrical pathways of the stretchable electronic element and the circuit board and/or the landing pads are integrally part of the electrical pathway of the stretchable electronic element, wherein the circuit board comprises a connecting pad comprising a conductive pad on a lower or contacting surface and wherein the conductive pad comprises one or more cavities that are substantially aligned with the landing pads of the stretchable electronic element.

4. An interconnect as claimed in claim 3 , wherein the landing pads extend at least partially into the one or more cavities in the conductive pad.

5. An interconnect as claimed in claim 3 , wherein the inner surfaces of the one or more cavities are partly or fully coated by electrically conductive material connected to the-electrical pathways of the circuit board.

6. An interconnect as claimed in claim 5 , wherein the one or more cavities in the conductive pad have a structure such that a planar area of a conductive material of the conductive pad that is most distal from the surface of the circuit board is larger than the area of the conductive material of a plane more proximate to the circuit board to create an overhanging region.

7. An interconnect as claimed in claim 3 , wherein the one or more cavities are filled or injected with liquid which is subsequently cured or set to provide electrically conductive material and form a cooperating shape to the one or more cavities.

8. An interconnect as claimed in claim 3 , wherein the conductive pad comprises multiple cavities that are aligned with a single electrical pathway on the circuit board.

9. An interconnect as claimed in claim 3 , wherein the circuit board is secured to the stretchable substrate so as to create a bias pressure forcing the landing pads of the stretchable electronic component and the conductive pads on the circuit board together such that the landing pads are elastically deformed.

10. An interconnect as claimed in claim 9 , wherein the bias pressure is provided by a fastener to hold the interconnect region in an elastically compressed state.

11. An interconnect as claimed in claim 3 , wherein the one or more cavities extend all the way through the circuit board to form vias, the vias over filled with liquid electrically conducting material and form a solid with a larger cross-sectional area than that of the via on the opposite side of the circuit board to the stretchable substrate.

12. An interconnect as claimed in claim 1 , wherein the circuit board is additionally bonded to the stretchable substrate by use of an adhesive or fastener to ensure alignment of the conductive pathways.

13. An interconnect as claimed in claim 1 , wherein a strain resistant layer is secured to the side of the stretchable substrate distal to the electrical circuit board to form a laminate with the stretchable substrate in the middle by one of an adhesive and/or fastener.

14. An interconnect as claimed in claim 13 , wherein the strain resistant layer is at least the same size as the planar area of the circuit board and aligned with the circuit board to substantially eliminate strain parallel to the surface of the circuit board where the landing pads and the conductive pads are electrically connected.

15. An interconnect as claimed in claim 13 , wherein the strain resistant layer is a flexible but substantially non-stretchable sheet.

16. An interconnect as claimed in claim 13 , wherein the strain resistant layer is a rigid sheet.

17. An interconnect as claimed in claim 1 , wherein the circuit board is bonded to the stretchable substrate by use of an adhesive, and wherein an adhesive layer forms a tapered region of tapered thickness starting from substantially the thickness of the circuit board at the perimeter of the circuit board and tapering down to the thickness of the stretchable electronic component over a distance of several millimeters in the direction extending perpendicularly outwards from the perimeter of the circuit board.

18. An interconnect as claimed in claim 17 , wherein the circuit board is additionally bonded to the stretchable substrate by use of a mechanical fastener to ensure alignment of the conductive pathways.