Display comprising light-emitting chips and manufacturing method therefor
A display according to one embodiment of the present invention comprises: a light-transmitting first layer and including a plurality of cavities; a plurality of light-emitting diode (LED) chips disposed in the cavities; and a second layer including a circuit electrically connected to the plurality of LED chips. Various other embodiments are also possible.
1. A display comprising:
a first layer that is light-transmitting and comprises a plurality of cavities;
a plurality of light-emitting diode (LED) chips disposed in the cavities; and
a second layer comprising a thin film transistor (TFT) electrically connected to at least one of the plurality of LED chips.
2. The display of claim 1 , wherein the cavities have a volume of substantially not more than 200×200×200 μm 3.
3. The display of claim 1 , wherein the first layer has a coefficient of thermal expansion that is substantially not more than 10×10 −6 m/m° C.
4. The display of claim 1 , wherein the first layer comprises glass.
5. The display of claim 1 , wherein the cavities comprise grooves or recesses, or holes disposed in the first layer.
6. The display of claim 1 , further comprising: a third layer that is electrically insulating and disposed between the first layer and the second layer.
7. The display of claim 1 , further comprising: a bonding material disposed between inner surfaces of the plurality of cavities and the plurality of LED chips.
8. The display of claim 1 , further comprising: one or more LED driving elements electrically connected to the TFT.
9. The display of claim 8 , wherein the one or more LED driving elements are coupled to the second layer.
10. The display of claim 8 , further comprising:
a circuit board comprising the one or more LED driving elements,
wherein the second layer is disposed between the first layer and the circuit board.
11. The display of claim 10 , further comprising:
a conductive material disposed between the second layer and the circuit board and electrically connecting the TFT and the circuit board; or
a flexible conductive member having a first end connected to the second layer and a second end connected to the circuit board.
12. An electronic device comprising the display of claim 1 .
13. A method for manufacturing a display, the method comprising:
forming a first layer that is light-transmitting and comprising a plurality of cavities;
disposing a plurality of light-emitting diode (LED) chips in the plurality of cavities; and
forming a second layer comprising a thin film transistor (TFT) electrically connected to at least one of the plurality of LED chips.
14. The method of claim 13 , wherein the first layer is formed of a light-transmitting material and has a coefficient of thermal expansion that is substantially not more than 10×10 −6 m/m° C.
15. The method of claim 13 , further comprising: before forming the second layer, fixing the plurality of LED chips in the plurality of cavities by coating an electrically insulating bonding material on the first layer.