IP Library › Granted Patent US 11,245,059
Granted Patent B2
US 11,245,059 · App. 16/650,998 · Granted Feb 8, 2022

Wiring board and light emitting device

Inventors: Akihito Kitagawa (Kyoto, JP); Yoshiaki Itakura (Kyoto, JP)
Assignee: KYOCERA CORPORATION
H01L33/60H01L33/62
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Quick Facts
Patent No.
US 11,245,059
App. No.
16/650,998
Granted
Feb 8, 2022
Kind
B2
Abstract

A wiring board includes a substrate for mounting a light emitting element; and a reflective film positioned on a surface of the substrate and reflecting light rays that are emitted from the light emitting element. The reflective film is formed of a plurality of adjacent columnar crystals extending in a perpendicular direction with respect to the surface of the substrate. A surface of the plurality of adjacent columnar crystals is in continuous at a surface of the reflective film.

Claims (55)

1. A wiring board comprising:

a substrate for mounting a light emitting element; and

a reflective film positioned on a surface of the substrate and reflecting light rays that are emitted from the light emitting element,

wherein the reflective film is formed of a plurality of adjacent columnar crystals extending in a perpendicular direction with respect to the surface of the substrate,

wherein a surface of the plurality of adjacent columnar crystals is in continuous at a surface of the reflective film, and

wherein the surface of the plurality of adjacent columnar crystal being continuous at the surface of the reflective film has the same shape as the surface of the substrate opposite to the surface of the plurality of adjacent columnar crystal which is continuous at the surface of the reflective film.

2. The wiring board according to claim 1 ,

wherein the reflective film reflects ultraviolet rays having a wavelength of 200 to 400 nm.

3. The wiring board according to claim 1 ,

wherein the reflective film is formed of aluminum.

4. The wiring board according to claim 3 ,

wherein the reflective film reflects ultraviolet rays having a wavelength of 200 to 400 nm.

5. A light emitting device comprising:

the wiring board according to claim 1 ; and

the light emitting element mounted on the substrate.

6. The light emitting device according to claim 5 ,

wherein the light emitting device emits ultraviolet rays having a wavelength of 200 to 400 nm.

7. The wiring board according to claim 1 ,

wherein the plurality of adjacent columnar crystals includes first columnar crystals being in direct contact with the surface of the substrate and second columnar crystals in contact with the first columnar crystals without being in direct contact with the surface of the substrate.

8. The wiring board according to claim 7 ,

wherein the reflective film reflects ultraviolet rays having a wavelength of 200 to 400 nm.

9. The wiring board according to claim 7 ,

wherein the reflective film is formed of aluminum.

10. The wiring board according to claim 9 ,

wherein the reflective film reflects ultraviolet rays having a wavelength of 200 to 400 nm.

11. A wiring board comprising:

a substrate for mounting a light emitting element; and

a reflective film positioned on a surface of the substrate and reflecting light rays that are emitted from the light emitting element,

wherein the reflective film is formed of a plurality of adjacent columnar crystals extending in a perpendicular direction with respect to the surface of the substrate,

wherein a surface of the plurality of adjacent columnar crystals is in continuous at a surface of the reflective film, and

wherein the plurality of adjacent columnar crystals includes first columnar crystals being in direct contact with the surface of the substrate and second columnar crystals in contact with the first columnar crystals without being in direct contact with the surface of the substrate.

12. The wiring board according to claim 11 ,

wherein the reflective film reflects ultraviolet rays having a wavelength of 200 to 400 nm.

13. The wiring board according to claim 11 ,

wherein the reflective film is formed of aluminum.

14. The wiring board according to claim 13 ,

wherein the reflective film reflects ultraviolet rays having a wavelength of 200 to 400 nm.

15. A light emitting device comprising:

the wiring board according to claim 11 ; and

the light emitting element mounted on the substrate.

16. The light emitting device according to claim 15 ,

wherein the light emitting device emits ultraviolet rays having a wavelength of 200 to 400 nm.

17. A wiring board, comprising:

a substrate for mounting a light emitting element; and

a reflective film positioned on a surface of the substrate and reflecting light rays that are emitted from the light emitting element,

wherein the reflective film is formed of a plurality of adjacent columnar crystals extending in a perpendicular direction with respect to the surface of the substrate,

wherein a surface of the plurality of adjacent columnar crystals is in continuous at a surface of the reflective film, and

wherein the reflective film is formed of aluminum.

18. The wiring board according to claim 17 ,

wherein the reflective film reflects ultraviolet rays having a wavelength of 200 to 400 nm.

19. A light emitting device comprising:

the wiring board according to claim 17 ; and

the light emitting element mounted on the substrate.

20. The light emitting device according to claim 19 ,

wherein the light emitting device emits ultraviolet rays having a wavelength of 200 to 400 nm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2020
From: KITAGAWA, AKIHIKO; ITAKURA, YOSHIAKI
To: KYOCERA CORPORATION
Reel/Frame 052239/0748 →
Priority Claims (1)
JP JP2017-185337 · Sep 26, 2017 · national
Continuity (1)
Related Publication 20200303606A1 · Sep 24, 2020