Photonics packaging method and device
Photonic packages are described. One such photonic package includes a photonic chip, an application specific integrated circuit, and optionally, an interposer. The photonic chip includes photonic microelectromechanical system (MEMS) devices. A photonic package may include a material layer patterned to include recesses. The recesses are aligned with the photonic MEMS devices so as to form enclosed cavities around the photonic MEMS devices. This arrangement preserves the integrity of the photonic MEMS devices.
1. A photonic package comprising:
a photonic chip having a plurality of photonic microelectromechanical system (MEMS) modulators configured to modulate light;
an application specific integrated circuit (ASIC) disposed on the photonic chip such that the ASIC is stacked on top of the plurality of photonic MEMS modulators, the ASIC being in electrical communication with the plurality of photonic MEMS modulators; and
an interposer disposed between the photonic chip and the ASIC.
2. The photonic package of claim 1 , wherein the interposer comprises a silicon interposer.
3. The photonic package of claim 1 , further comprising a non-conductive film disposed between the photonic chip and the ASIC, the non-conductive film being patterned with a plurality of recesses, wherein the plurality of recesses are aligned with respective photonic MEMS modulators of the photonic chip.
4. The photonic package of claim 3 , further comprising a plurality of conductive pillars electrically connecting the ASIC with the plurality of photonic MEMS modulators, wherein the plurality of conductive pillars pass through the non-conductive film.
5. The photonic package of claim 1 , wherein at least one of the plurality of photonic MEMS modulators comprises a photonic phase modulator.
6. The photonic package of claim 1 , wherein at least one of the plurality of photonic MEMS modulators comprises a suspended optical waveguide.
7. The photonic package of claim 1 , wherein the photonic chip is positioned in a depression formed on a circuit board.
8. The photonic package of claim 1 , further comprising an optical fiber edge-coupled to the photonic chip and configured to provide the light to the plurality of photonic MEMS modulators.
9. The photonic package of claim 8 , further comprising a laser coupled to the optical fiber.
10. The photonic package of claim 1 , wherein the photonic chip further comprises a silicon photonic integrated circuit.
11. The photonic package of claim 1 , wherein the ASIC comprises a driver configured to cause motion of at least one of the plurality of photonic MEMS modulators.