Semiconductor device and fabricating method thereof
A semiconductor device includes an enhancement mode high electron mobility transistor (HEMT) with an active region and an isolation region. The HEMT includes a substrate, a group III-V body layer, a group III-V barrier layer, a group III-V gate structure and a group III-V patterned structure. The group III-V body layer and the group III-V barrier layer are disposed on the substrate. The group III-V gate structure is disposed on the group III-V barrier layer within the active region. The group III-V patterned structure is disposed on the group III-V barrier layer within the isolation region. The composition of the group III-V patterned structure is the same as the composition of the group III-V gate structure.
1. A method of fabricating a semiconductor device comprising an active region and an isolation region, wherein the method comprises:
providing a substrate having a group III-V body layer, a group III-V barrier layer, and a group III-V gate layer thereon; and
patterning the group III-V gate layer to form a group III-V gate structure in the active region and a group III-V patterned structure in the isolation region.
2. The method of fabricating the semiconductor device according to claim 1 , wherein the group III-V gate structure and the group III-V patterned structure are formed concurrently.
3. The method of fabricating the semiconductor device according to claim 1 , further comprising:
forming a patterned etch mask layer on the group III-V gate layer; and
etching the group III-V gate layer by using the patterned etch mask layer as an etch mask.
4. The method of fabricating the semiconductor device according to claim 3 , further comprising depositing a passivation layer on the group III-V gate structure and the group III-V patterned structure.
5. The method of fabricating the semiconductor device according to claim 4 , wherein a composition of the passivation layer comprises aluminum nitride, aluminum oxide or silicon nitride.
6. The method of fabricating the semiconductor device according to claim 4 , wherein the etch mask layer is disposed between the passivation layer and the group III-V patterned structure.
7. The method of fabricating the semiconductor device according to claim 4 , further comprising forming a gate electrode and at least two source/drain electrodes penetrating the passivation layer respectively, wherein the electrodes are spaced apart from the group III-V patterned structure.
8. The method of fabricating the semiconductor device according to claim 1 , wherein a bottom surface of the group III-V gate structure is aligned with a bottom surface of the group III-V patterned structure.
9. The method of fabricating the semiconductor device according to claim 1 , wherein s composition of the group III-V gate structure and a composition of the group III-V patterned structure are p-type GaN or p-type AlGaN.
10. The method of fabricating the semiconductor device according to claim 1 , wherein an etch stop layer is disposed on the substrate, and the etch stop layer is disposed between the group III-V barrier layer and the group III-V gate layer.
11. A method of fabricating a semiconductor device comprising an active region and an isolation region, wherein the method comprises:
providing a substrate having a group III-V body layer, a group III-V barrier layer, and a group III-V gate layer thereon;
patterning the group III-V gate layer to form a group III-V gate structure in the active region and a group III-V patterned structure in the isolation region; and
forming a gate electrode on the group III-V gate structure, wherein a top surface of the gate electrode is higher than a top surface of the group III-V patterned structure.