Metal stack templates for suppressing secondary grains in sca1n
A metal stack for templating the growth of AlN and ScAlN films is disclosed. The metal stack comprises one, two, or three layers of metal, each of which is compatible with CMOS post-processing. The metal stack provides a template that promotes the growth of highly textured c-axis {002} AlN and ScAlN films. The metal stacks include one or more metal layers with each metal layer having either a hexagonal {002} orientation or a cubic {111} orientation. If the metal stack includes two or more metal layers, the layers can alternate between hexagonal {002} and cubic {111} orientations. The use of ScAlN results in a higher piezoelectric constant compared to that of AlN for ScAlN alloys up to approximately 44% Sc. The disclosed metal stacks resulted in ScAlN films having XRD FWHM values of less than approximately 1.1° while significantly reducing the formation of secondary grains in the ScAlN films.
1. A piezoelectric device comprising:
a substrate;
a metal stack formed on a surface of the substrate, the metal stack comprising one or more post-CMOS process compatible metals; and
a highly textured hexagonal {002} oriented scandium aluminum nitride (ScAlN) piezoelectric film formed on a template surface of the metal stack, the metal stack adapted to provide a template for the highly textured hexagonal {002} oriented ScAlN piezoelectric film, the highly textured hexagonal {002} oriented ScAlN piezoelectric film having a composition of between aluminum nitride (AlN) and about Sc 0.44 Al 0.56 N.
2. The piezoelectric device of claim 1 , wherein the substrate comprises one of a semiconductor wafer, a processed semiconductor wafer, a composite wafer, and a cavity SOI wafer.
3. The piezoelectric device of claim 1 , further comprising a sub-template layer, the sub-template layer formed between the substrate and the metal stack.
4. The piezoelectric device of claim 1 , wherein the metal stack comprises a single-layer metal stack comprising a metal having a hexagonal {002} orientation or a metal having a cubic {111} orientation.
5. The piezoelectric device of claim 4 ,
wherein if the single-layer metal stack comprises a metal having a hexagonal {002} orientation, the metal stack includes one of hexagonal titanium (Ti) having a {002} orientation and hexagonal scandium (Sc) having a {002} orientation, and
wherein if the single-layer metal stack comprises a metal having a cubic {111} orientation, the metal stack includes one of tantalum nitride (TaN) having a {111} orientation, cubic niobium nitride (NbN) having a {111} orientation, and cubic aluminum scandium (Al 3 Sc) having a {111} orientation.
6. The piezoelectric device of claim 1 ,
wherein the metal stack comprises a double-layer metal stack,
wherein a first layer of the double-layer metal stack is formed on the surface of the substrate, the first layer comprising a metal having a first orientation,
wherein a second layer of the double-layer metal stack is formed on a surface of the first layer of the metal stack, the second layer comprising a metal having a second orientation, and
wherein one of the first orientation and the second orientation is a hexagonal {002} orientation and one of the first orientation and the second orientation is a cubic {111} orientation.
7. The piezoelectric device of claim 6 , wherein the first layer comprises one of hexagonal titanium (Ti) having a {002} orientation, hexagonal scandium (Sc) having a {002} orientation, cubic tantalum nitride (TaN) having a {111} orientation, cubic niobium nitride (NbN) having a {111} orientation, and cubic aluminum scandium (Al 3 Sc) having a {111} orientation.
8. The piezoelectric device of claim 6 , wherein the second layer comprises aluminum (Al).
9. The piezoelectric device of claim 8 , wherein the second layer comprises an alloy of aluminum (Al) and copper (Cu) containing approximately 0.5 wt % Cu.
10. The piezoelectric device of claim 1 ,
wherein the metal stack comprises a triple-layer metal stack,
wherein a first layer of the triple-layer metal stack is formed on the surface of the substrate, the first layer comprising a metal having a first orientation,
wherein a second layer of the double-layer metal stack is formed on a surface of the first layer of the metal stack, the second layer comprising a metal having a second orientation, and
wherein a third layer of the double-layer metal stack is formed on a surface of the second layer of the metal stack, and
wherein one of the first orientation and the second orientation is a hexagonal {002} orientation and one of the first orientation and the second orientation is a cubic {111} orientation.
11. The piezoelectric device of claim 10 , wherein the first layer comprises one of hexagonal titanium (Ti) having a {002} orientation, hexagonal scandium (Sc) having a {002} orientation, cubic tantalum nitride (TaN) having a {111} orientation, cubic niobium nitride (NbN) having a {111} orientation, and cubic aluminum scandium (Al 3 Sc) having a {111} orientation.
12. The piezoelectric device of claim 10 , wherein the second layer comprises titanium nitride (TiN).
13. The piezoelectric device of claim 10 , wherein the third layer comprises aluminum (Al).
14. The piezoelectric device of claim 13 , wherein the third layer comprises an alloy of aluminum (Al) and copper (Cu) containing approximately 0.5 wt % Cu.
15. The piezoelectric device of claim 1 , wherein the metal stack is formed under continuous vacuum conditions.
16. The piezoelectric device of claim 1 , wherein at least a portion of the metal stack is deposited by an ionized metal plasma (IMP) process.