IP Library › Granted Patent US 11,329,041
Granted Patent B2
US 11,329,041 · App. 16/668,111 · Granted May 10, 2022

Semiconductor integrated circuit, electronic device and vehicle

Inventor: Noboru Itomi (Nirasaki, JP)
Assignee: SEIKO EPSON CORPORATION
H01L27/092H01L27/0207H03K17/693
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Quick Facts
Patent No.
US 11,329,041
App. No.
16/668,111
Granted
May 10, 2022
Kind
B2
Abstract

A semiconductor integrated circuit includes a first MOS transistor, a second MOS transistor, and a P+ region. The first MOS transistor is an NMOS transistor which has a first N-type region and a second N-type region and in which a first power supply voltage is supplied to the first N-type region. The second MOS transistor is an NMOS transistor which has a third N-type region and a fourth N-type region and in which a second power supply voltage higher than the first power supply voltage is supplied to the third N-type region. The P+ region is supplied with the first power supply voltage. In plan view of the semiconductor substrate, the first MOS transistor and the second MOS transistor are disposed to be adjacent to each other, and the P+ region is located between the first N-type region and the third N-type region.

Claims (73)

1. A semiconductor integrated circuit comprising:

an external terminal supplying a first power supply voltage;

a power supply circuit configured to generate a second power supply voltage greater than the first power supply voltage;

a semiconductor substrate; and

a first MOS transistor, a second MOS transistor and a P+ region that are provided on the semiconductor substrate, wherein

the first MOS transistor is an NMOS transistor which has a first N-type region and a second N-type region and in which the first N-type region is electrically connected to the external terminal and is supplied with the first power supply voltage,

the second MOS transistor is an NMOS transistor which has a third N-type region and a fourth N-type region and in which the third N-type region is electrically connected to the power supply circuit and is supplied with the second power supply voltage,

the P+ region is supplied with the first power supply voltage, and

in plan view of the semiconductor substrate,

the first MOS transistor and the second MOS transistor are disposed to be adjacent to each other, and

the P+ region is located between the first N-type region and the third N-type region.

2. The semiconductor integrated circuit according to claim 1 , wherein

in plan view of the semiconductor substrate,

the fourth N-type region is located between the first N-type region and the third N-type region.

3. A semiconductor integrated circuit comprising:

an external terminal supplying a first power supply voltage;

a power supply circuit configured to generate a second power supply voltage greater than the first power supply voltage;

a semiconductor substrate; and

a first MOS transistor and a second MOS transistor that are provided on the semiconductor substrate, wherein

the first MOS transistor is an NMOS transistor which has a first N-type region and a second N-type region and in which the first N-type region is electrically connected to the external terminal and is supplied with the first power supply voltage,

the second MOS transistor is an NMOS transistor which has a third N-type region and a fourth N-type region and in which the third N-type region is electrically connected to the power supply circuit and is supplied with the second power supply voltage, and

in plan view of the semiconductor substrate,

the first MOS transistor and the second MOS transistor are disposed to be adjacent to each other, and

the fourth N-type region is located between the first N-type region and the third N-type region.

4. The semiconductor integrated circuit according to claim 1 , wherein

the power supply circuit is configured to generate a third power supply voltage greater than the first power supply voltage,

the semiconductor integrated circuit further comprises a third MOS transistor and a fourth MOS transistor that are provided on the semiconductor substrate,

the third MOS transistor is an NMOS transistor which has a fifth N-type region and a sixth N-type region and in which the fifth N-type region is electrically connected to the external terminal and is supplied with the first power supply voltage,

the fourth MOS transistor is an NMOS transistor which has a seventh N-type region and an eighth N-type region and in which the seventh N-type region is electrically connected to the power supply circuit and is supplied with the third power supply voltage, and

in plan view of the semiconductor substrate,

the first MOS transistor and the third MOS transistor are disposed to be adjacent to each other, and

the second MOS transistor and the fourth MOS transistor are disposed to be adjacent to each other, and

the first N-type region and the third N-type region are located between the fifth N-type region and the seventh N-type region.

5. A semiconductor integrated circuit comprising:

an external terminal supplying a first power supply voltage;

a power supply circuit configured to generate a second power supply voltage lesser than the first power supply voltage;

a semiconductor substrate; and

a first MOS transistor, a second MOS transistor and an N+ region that are provided on the semiconductor substrate wherein,

the first MOS transistor is a PMOS transistor which has a first P-type region and a second P-type region, and in which the first P-type region is electrically connected to the external terminal and is supplied with the first power supply voltage,

the second MOS transistor is a PMOS transistor which has a third P-type region and a fourth P-type region and in which the third P-type region is electrically connected to the power supply circuit and is supplied with the second power supply voltage,

the N+ region is supplied with the first power supply voltage, and

in plan view of the semiconductor substrate,

the first MOS transistor and the second MOS transistor are disposed to be adjacent to each other, and

the N+ region is located between the first P-type region and the third P-type region.

6. The semiconductor integrated circuit according to claim 5 , wherein

in plan view of the semiconductor substrate,

the fourth P-type region is located between the first P-type region and the third P-type region.

7. A semiconductor integrated circuit comprising:

an external terminal supplying a first power supply voltage;

a power supply circuit configured to generate a second power supply voltage lesser than the first power supply voltage;

a semiconductor substrate; and

a first MOS transistor and a second MOS transistor that are provided on the semiconductor substrate, wherein

the first MOS transistor is a PMOS transistor which has a first P-type region and a second P-type region, and in which the first P-type region is electrically connected to the external terminal and is supplied with the first power supply voltage,

the second MOS transistor is a PMOS transistor which has a third P-type region and a fourth P-type region and in which the third P-type region is electrically connected to the power supply circuit and is supplied with the second power supply voltage,

in plan view of the semiconductor substrate,

the first MOS transistor and the second MOS transistor are disposed to be adjacent to each other, and

the fourth P-type region is located between the first P-type region and the third P-type region.

8. The semiconductor integrated circuit according to claim 5 , wherein

the power supply circuit configured to generate a third power supply voltage lesser than the first power supply voltage,

the semiconductor integrated circuit further comprises a third MOS transistor and a fourth MOS transistor that are provided on the semiconductor substrate,

the third MOS transistor is a PMOS transistor which has a fifth P-type region and a sixth P-type region and in which the fifth P-type region is electrically connected to the external terminal and is supplied with the first power supply voltage,

the fourth MOS transistor is a PMOS transistor which has a seventh P-type region and an eighth P-type region and in which the seventh P-type region is electrically connected to the power supply circuit and is supplied with the third power supply voltage,

in plan view of the semiconductor substrate,

the first MOS transistor and the third MOS transistor are disposed to be adjacent to each other, and

the second MOS transistor and the fourth MOS transistor are disposed to be adjacent to each other, and

the first P-type region and the third P-type region are located between the fifth P-type region and the seventh P-type region.

9. The semiconductor integrated circuit according to claim 1 , further comprising:

a fifth MOS transistor; and

a sixth MOS transistor; wherein

an inverter circuit includes the first MOS transistor and the fifth MOS transistor, and

an analog switch circuit includes the second MOS transistor and the sixth MOS transistor.

10. An electronic device comprising the semiconductor integrated circuit according to claim 1 .

11. A vehicle comprising the semiconductor integrated circuit according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2019
From: ITOMI, NOBORU
To: SEIKO EPSON CORPORATION
Reel/Frame 050861/0178 →
Priority Claims (1)
JP JP2018-205039 · Oct 31, 2018 · national
Continuity (1)
Related Publication 20200135731A1 · Apr 30, 2020