Semiconductor substrate die sawing singulation systems and methods
View Patent ↗Implementations of methods of cutting a semiconductor substrate may include aligning a first saw blade substantially perpendicularly with a crystal plane of a non-cubic crystalline lattice of a semiconductor substrate coupled with a backmetal layer and cutting through at least a majority of the semiconductor substrate at an angle substantially perpendicular with the crystal plane of the non-cubic crystalline lattice of the semiconductor substrate. The method may also include aligning a second saw blade substantially perpendicularly with the semiconductor substrate and cutting entirely through the semiconductor substrate and the backmetal layer using the second saw blade.
1. A method for cutting a semiconductor substrate comprising:
aligning a first saw blade substantially perpendicularly with a crystal plane of a non-cubic crystalline lattice of a semiconductor substrate coupled with a backmetal layer;
cutting through at least a majority of the semiconductor substrate at an angle substantially perpendicular with the crystal plane of the non-cubic crystalline lattice of the semiconductor substrate
aligning a second saw blade substantially perpendicularly with the semiconductor substrate; and
cutting entirely through the semiconductor substrate and the backmetal layer using the second saw blade.
2. The method of claim 1 , wherein the non-cubic crystalline lattice is hexagonal.
3. The method of claim 1 , wherein the crystal plane is angled at four degrees from a largest planar surface of the semiconductor substrate.
4. The method of claim 1 , wherein the first saw blade is aligned by tilting relative to the semiconductor substrate.
5. The method of claim 1 , wherein the first saw blade is aligned by tilting the semiconductor substrate relative to the first saw blade.
6. The method of claim 1 , wherein cutting through at least the majority of the semiconductor substrate further comprises cutting through 95% of the semiconductor substrate.
7. The method of claim 1 , wherein cutting through at least the majority of the semiconductor substrate further comprises cutting through 99% of the semiconductor substrate.
8. A method for cutting a silicon carbide semiconductor substrate comprising:
aligning a first saw blade substantially perpendicularly with an off angle of the crystal lattice of a silicon carbide semiconductor substrate coupled with a backmetal layer;
cutting through at least a majority of the silicon carbide semiconductor substrate with the first saw blade at a substantially perpendicular angle;
aligning a second saw blade substantially perpendicularly with the silicon carbide semiconductor substrate; and
cutting entirely through the silicon carbide semiconductor substrate and the backmetal layer using the second saw blade.
9. The method of claim 8 , wherein cutting through at least the majority of the silicon carbide semiconductor substrate further comprises cutting through 95% of the silicon carbide semiconductor substrate.
10. The method of claim 8 , wherein the crystal lattice is angled at four degrees relative to a largest planar surface of the silicon carbide semiconductor substrate.
11. The method of claim 8 , wherein the first saw blade is aligned by tilting relative to the silicon carbide semiconductor substrate.
12. The method of claim 8 , wherein the first saw blade is aligned by tilting the silicon carbide semiconductor substrate relative to the first saw blade.
13. A method for singulating a silicon carbide semiconductor substrate comprising:
aligning a first saw blade substantially parallel with a c-axis of a silicon carbide semiconductor substrate coupled with a backmetal layer;
cutting through at least a majority of the silicon carbide semiconductor substrate at an angle substantially parallel with the c-axis of the silicon carbide semiconductor substrate;
aligning a second saw blade substantially perpendicularly with the silicon carbide semiconductor substrate; and
singulating the silicon carbide semiconductor substrate into a plurality of semiconductor die by cutting entirely through the silicon carbide semiconductor substrate and the backmetal layer using the second saw blade.
14. The method of claim 13 , further comprising tilting the first saw blade relative to the silicon carbide semiconductor substrate from a first position to a second position and cutting the silicon carbide semiconductor substrate in a first direction.
15. The method of claim 14 , further comprising tilting the first saw blade back to the first position.
16. The method of claim 14 , further comprising tilting the silicon carbide semiconductor substrate relative to the first saw blade and cutting the silicon carbide substrate in a second position.
17. The method of claim 13 , wherein the first saw blade and the second saw blade comprise diamond.
18. The method of claim 13 , wherein the c-axis is angled at four degrees relative to a largest planar surface of the silicon carbide semiconductor substrate.
19. The method of claim 13 , wherein a first sidewall and a second sidewall of each semiconductor die of the plurality of semiconductor die are each angled relative to a largest planar surface of each semiconductor die.
20. The method of claim 19 , wherein a third sidewall and a fourth sidewall of each semiconductor die of the plurality of semiconductor die are each substantially perpendicular to the largest planar surface of each semiconductor die.