Structure and formation method of semiconductor device with metal gate stack
View Patent ↗A structure and a formation method of a semiconductor device are provided. The method includes forming a dummy gate stack over a semiconductor substrate and forming spacer elements over sidewalls of the dummy gate stack. The method also includes removing the dummy gate stack to form a recess between the spacer elements and forming a metal gate stack in the recess. The method further includes etching back the metal gate stack while the metal gate stack is kept at a temperature that is in a range from about 20 degrees C. to about 55 degrees C. In addition, the method includes forming a protection element over the metal gate stack after etching back the metal gate stack.
1. A method for forming a semiconductor device structure, comprising:
forming a dummy gate stack over a semiconductor substrate;
forming spacer elements over sidewalls of the dummy gate stack;
removing the dummy gate stack to form a recess between the spacer elements;
forming a metal gate stack in the recess;
etching back the metal gate stack while the metal gate stack is kept at a temperature that is in a range from about 20 degrees C. to about 55 degrees C., wherein the metal gate stack is etched back using a dry etching process, and a reaction gas mixture used in the dry etching process comprises a first halogen-containing gas, a second halogen-containing gas, and an inert gas, wherein the first halogen-containing gas has a first molecular weight, the second halogen-containing gas has a second molecular weight, and the second molecular weight is greater than the first molecular weight; and
forming a protection element over the metal gate stack after etching back the metal gate stack.
2. The method for forming a semiconductor device structure as claimed in claim 1 , wherein the temperature is in a range from about 45 degrees C. to about 50 degrees C.
3. The method for forming a semiconductor device structure as claimed in claim 1 , wherein the first halogen-containing gas comprises Cl 2 , F 2 , or a combination thereof.
4. The method for forming a semiconductor device structure as claimed in claim 1 , wherein the second halogen-containing gas comprises BCl 3 , SiCl 4 , or a combination thereof.
5. The method for forming a semiconductor device structure as claimed in claim 1 , wherein the reaction gas mixture used in the dry etching process further comprises an oxygen-containing gas.
6. The method for forming a semiconductor device structure as claimed in claim 5 , wherein the oxygen-containing gas comprises O 2 , O 3 , NO, NO 2 , or a combination thereof.
7. The method for forming a semiconductor device structure as claimed in claim 5 , wherein the oxygen-containing gas is provided at a first flow rate, the second halogen-containing gas is provided at a second flow rate, and a ratio of the first flow rate to the second flow rate is in a range from about 0.05 to about 0.6.
8. The method for forming a semiconductor device structure as claimed in claim 1 , further comprising exciting the reaction gas mixture to generate plasma.
9. The method for forming a semiconductor device structure as claimed in claim 1 , wherein the etching back of the metal gate stack forms an opening over the metal gate stack, and a bottom of the opening is higher than a bottom of the metal gate stack.
10. A method for forming a semiconductor device structure, comprising:
forming a metal gate stack over a semiconductor substrate;
removing an upper portion of the metal gate stack using an etching process while the metal gate stack is kept at a temperature that is in a range from about 20 degrees C. to about 55 degrees C., wherein a reaction gas mixture used in the etching process comprises a first halogen-containing gas and a second halogen-containing gas, the first halogen-containing gas has a first molecular weight, the second halogen-containing gas has a second molecular weight, the second molecular weight is greater than the first molecular weight, the first halogen-containing gas is provided at a first flow rate, the second halogen-containing gas is provided at a second flow rate, and the first flow rate is faster than the second flow rate; and
forming a protection element over the metal gate stack after the upper portion of the metal gate stack is removed.
11. The method for forming a semiconductor device structure as claimed in claim 10 , wherein the reaction gas mixture further comprises an oxygen-containing gas.
12. The method for forming a semiconductor device structure as claimed in claim 11 , wherein the second halogen-containing gas comprises BCl 3 .
13. The method for forming a semiconductor device structure as claimed in claim 12 , wherein the oxygen-containing gas comprises O 2 .
14. The method for forming a semiconductor device structure as claimed in claim 13 , wherein the oxygen-containing gas is provided at a third flow rate, and a ratio of the third flow rate to the second flow rate is in a range from about 0.05 to about 0.6.
15. A method for forming a semiconductor device structure, comprising:
forming a metal gate stack over a semiconductor substrate;
removing an upper portion of the metal gate stack using an etching process while the metal gate stack is kept at a temperature that is lower than about 55 degrees C., wherein a reaction gas mixture used in the etching process comprises a first halogen-containing gas and a second halogen-containing gas, the first halogen-containing gas has a first molecular weight, the second halogen-containing gas has a second molecular weight, and the second molecular weight is greater than the first molecular weight; and
forming a protection element over the metal gate stack after the upper portion of the metal gate stack is etched.
16. The method for forming a semiconductor device structure as claimed in claim 15 , wherein the first halogen-containing gas is provided at a first flow rate, the second halogen-containing gas is provided at a second flow rate, and the first flow rate is different than the second flow rate.
17. The method for forming a semiconductor device structure as claimed in claim 16 , wherein the first flow rate is faster than the second flow rate.
18. The method for forming a semiconductor device structure as claimed in claim 16 , wherein the reaction gas mixture used in the etching process further comprises an oxygen-containing gas.
19. The method for forming a semiconductor device structure as claimed in claim 18 , wherein the oxygen-containing gas is provided at a third flow rate, and a ratio of the third flow rate to the second flow rate is in a range from about 0.05 to about 0.6.
20. The method for forming a semiconductor device structure as claimed in claim 15 , wherein the removal of the upper portion of the metal gate stack forms an opening over the metal gate stack, and a bottom of the opening is higher than a bottom of the metal gate stack.