IP Library › Granted Patent US 11,967,605
Granted Patent B2
US 11,967,605 · App. 16/676,711 · Granted Apr 23, 2024

Light emitting device

Inventor: Chung Hoon Lee (Ansan-si, KR)
Assignee: SEOUL VIOSYS CO., LTD.
H01L27/15H01L33/382H01L33/44H01L33/505H01L33/62H01L2933/0016H01L2933/0025H01L2933/0066
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Quick Facts
Patent No.
US 11,967,605
App. No.
16/676,711
Granted
Apr 23, 2024
Kind
B2
Abstract

A light emitting device including a light emitting structure including a plurality of light emitting parts, a dielectric structure disposed outside the light emitting structure, and a plurality of pads disposed on a first surface of the light emitting structure and electrically coupled with the light emitting parts, in which outer sidewalls of the pads are disposed inside an outer sidewall of the light emitting structure and an outer sidewall of the dielectric structure, at least one of the pads extends to a first surface of the dielectric structure, and the first surface of the dielectric structure is coplanar with the first surface of the light emitting structure.

Claims (41)

1. A light emitting apparatus comprising:

a light emitting structure including a plurality of light emitting parts comprising a first light emitting part, a second light emitting part, and a third light emitting part each including a first-type semiconductor layer, an active layer, and a second-type semiconductor layer;

a dielectric structure disposed outside the light emitting; and

a plurality of pads disposed on a first surface of the light emitting structure and electrically coupled with the light emitting parts, the pads comprising:

a first pad electrically coupled with the second-type semiconductor layer of the first light emitting part;

a second pad electrically coupled with the second-type semiconductor layer of the second light emitting part;

a third pad electrically coupled with the second-type semiconductor layer of the third light emitting part; and

a common pad electrically coupled with the first-type semiconductor layers of the first, second, and third light emitting parts, the common pad comprising:

a first portion covering at least a portion of the first light emitting part and having a first width in a first direction; and

a second portion extending from the first portion to the first surface of the dielectric structure and having a second width greater than the first width in the first direction,

wherein outer sidewalls of the pads are disposed in a region defined by the light emitting structure and the dielectric structure,

wherein one of the pads extends from the first surface of the light emitting structure to be disposed on a first surface of the dielectric structure, and

wherein the common pad vertically overlaps at least a portion of each of the first light emitting part, the second light emitting part, and the third light emitting part.

2. The light emitting apparatus according to claim 1 , wherein remaining pads except the one of the pads that extends to the dielectric structure are disposed within the light emitting structure.

3. The light emitting apparatus according to claim 1 , wherein the one of the pads that extend to the dielectric structure comprises the common pad.

4. The light emitting apparatus according to claim 3 , wherein remaining pads except the one of the pads that extends to the dielectric structure have a third width greater than the first width.

5. The light emitting apparatus according to claim 1 , wherein the one of the pads that extends to the dielectric structure comprises:

a first portion disposed on the first surface of the light emitting structure and having a first area; and

a second portion extending from the first portion to the first surface of the dielectric structure and having a second area greater than the first area.

6. The light emitting apparatus according to claim 1 , wherein the pads are horizontally spaced apart from each another.

7. The light emitting apparatus according to claim 1 , wherein:

the light emitting structure is formed in plural;

the dielectric structure is disposed between the light emitting structures; and

the one of the pads that extends to the first surface of the dielectric structure is electrically coupled with at least one of light emitting parts of a neighboring light emitting structure.

8. The light emitting apparatus-according to claim 1 , further comprising conductive parts disposed on the pads and electrically bonding the pads to a mounting substrate,

wherein the one of the pads is disposed between at least one of the conductive parts and the first surface of the dielectric structure.

9. The light emitting apparatus according to claim 1 , wherein:

the first pad is electrically coupled with the second-type semiconductor layer of the first light emitting part through a first through pattern;

the second pad is electrically coupled with the second-type semiconductor layer of the second light emitting part through a second through pattern;

the third pad is electrically coupled with the second-type semiconductor layer of the third light emitting part through a third through pattern; and

the common pad is electrically coupled with the first-type semiconductor layers of the first, second, and third light emitting parts through a fourth through pattern, a fifth through pattern, and a sixth through pattern.

10. The light emitting apparatus according to claim 9 , wherein each of the first and third pads has a third width greater than the first width.

11. The light emitting apparatus according to claim 9 , wherein:

the common pad entirely covers the first surface of the light emitting structure and includes holes exposing the first, second, and third through patterns, respectively; and

the first, second, and third through patterns are electrically coupled with the first, second, and third pads through the holes, respectively.

12. The light emitting apparatus according to claim 11 , further comprising a passivation layer insulating the common pad and the first, second, and third pads from one another.

13. The light emitting apparatus according to claim 9 , wherein:

the light emitting structure is formed in plural;

the dielectric structure is disposed between the light emitting structures; and

the common pads of neighboring light emitting structures are integrated with each other.

14. The light emitting apparatus according to claim 13 , wherein the first-type semiconductor layers of neighboring light emitting structures are integrated with each other.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2019
From: LEE, CHUNG HOON
To: SEOUL VIOSYS CO., LTD.
Reel/Frame 050945/0193 →
Continuity (2)
Provisional Application 62760381 · Nov 13, 2018
Related Publication 20200152691A1 · May 14, 2020