Film stack overlay improvement
An apparatus and a method for depositing a film layer that may have minimum contribution to overlay error after a sequence of deposition and lithographic exposure processes are provided. In one example, a method includes positioning a substrate on a substrate support in a process chamber, and flowing a deposition gas mixture comprising a silicon containing gas and a reacting gas to the process chamber through a showerhead having a convex surface facing the substrate support or a concave surface facing the substrate support in accordance with a stress profile of the substrate. A plasma is formed in the presence of the deposition gas mixture in the process chamber by applying an RF power to multiple coupling points of the showerhead that are symmetrically arranged about a center point of the showerhead. A deposition process is then performed on the substrate.
1. A method for forming a film layer on a substrate, comprising:
positioning a substrate on a substrate support in a process chamber;
flowing a deposition gas mixture comprising a silicon containing gas and a reacting gas to the process chamber through a showerhead having a convex surface facing the substrate support or a concave surface facing the substrate support in accordance with a compressive or tensile stress profile of the substrate;
forming a plasma in the presence of the deposition gas mixture in the process chamber by applying an RF power to multiple coupling points of the showerhead that are symmetrically arranged about a center point of the showerhead;
performing a deposition process while rotating the substrate to deposit a film layer on the substrate; and
delivering the deposition gas mixture through a blocking plate disposed above the showerhead by:
flowing the deposition gas mixture through apertures at a center region of the blocking plate with a first density and apertures at an edge region of the blocking plate with a second density lower than the first density, if the center region of the substrate has a higher compressive stress than a compressive stress at the edge region of the substrate; or
flowing the deposition gas mixture through apertures at the center region of the blocking plate with a third density and apertures at the edge region of the blocking plate with a fourth density higher than the third density, if the center region of the substrate has a less compressive stress than a compressive stress at the edge region of the substrate.
2. The method of claim 1 , wherein the silicon containing gas includes at least one of silane, di-silane, silicon tetrafluoride, silicon tetrachloride, dichlorsilane, and tetraethyl orthosilicate; and wherein the reacting gas comprises at least one of an oxygen containing gas, a nitrogen containing gas, and a carbon containing gas.
3. The method of claim 1 , further comprising:
tuning side-to-side or front-to-back plasma density over the substrate by adjusting a height of the substrate support during the deposition process.
4. The method of claim 1 , wherein the film layer is a film stack comprising a first film layer and a second film layer disposed on the first film layer, the first film layer and the second film layer are alternatively and repeatedly formed in the film stack, and the film stack has a local bow range less than 200 μm.
5. The method of claim 4 , wherein the first film layer is a silicon oxide layer, and the second film layer is a silicon nitride layer.
6. A method for forming a film layer on a substrate, comprising:
positioning a substrate on a substrate support in a process chamber;
flowing a deposition gas mixture comprising a silicon containing gas and a reacting gas to the process chamber through a showerhead having a convex surface facing the substrate support or a concave surface facing the substrate support in accordance with a compressive or tensile stress profile of the substrate;
forming a plasma in the presence of the deposition gas mixture in the process chamber by applying an RF power to multiple coupling points of the showerhead that are symmetrically arranged about a center point of the showerhead;
performing a deposition process while rotating the substrate to deposit a film layer on the substrate; and
tuning plasma density over the substrate by:
maintaining a first electrode at an outer zone of the substrate support at a first impedance and a second electrode at an inner zone of the substrate at a second impedance higher than the first impedance, if the center region of the substrate has a higher compressive stress than a compressive stress at an edge region of the substrate; or
maintaining the first electrode at the outer zone of the substrate support at a third impedance and the second electrode at the inner zone of the substrate at a fourth impedance lower than the third impedance, if the center region of the substrate has a less compressive stress than a compressive stress at the edge region of the substrate.
7. A method for forming a film layer on a substrate, comprising:
positioning a substrate on a substrate support in a process chamber, the substrate support having a concave substrate supporting surface or a convex substrate supporting surface in accordance with a compressive or tensile stress profile of the substrate;
flowing a deposition gas mixture comprising a silicon containing gas and a reacting gas to a process chamber through a showerhead;
forming a plasma in the presence of the deposition gas mixture in the process chamber by applying an RF power to multiple coupling points of the showerhead that are symmetrically arranged about a center point of the showerhead;
performing a deposition process while rotating the substrate to deposit a film layer on the substrate; and
delivering the deposition gas mixture through a blocking plate disposed above the showerhead by:
flowing the deposition gas mixture through apertures at a center region of the blocking plate with a first density and apertures at an edge region of the blocking plate with a second density lower than the first density, if the center region of the substrate has a higher compressive stress than a compressive stress at the edge region of the substrate; or
flowing the deposition gas mixture through apertures at the center region of the blocking plate with a third density and apertures at the edge region of the blocking plate with a fourth density higher than the third density, if the center region of the substrate has a less compressive stress than a compressive stress at the edge region of the substrate.
8. The method of claim 7 , wherein the silicon containing gas includes at least one of silane, di-silane, silicon tetrafluoride, silicon tetrachloride, dichlorsilane, and tetraethyl orthosilicate; and wherein the reacting gas comprises at least one of an oxygen containing gas, a nitrogen containing gas, and a carbon containing gas.
9. The method of claim 7 , further comprising:
tuning side-to-side or front-to-back plasma density over the substrate by adjusting a height of the substrate support during the deposition process.
10. The method of claim 7 , wherein the film layer is a film stack comprising a first film layer and a second film layer disposed on the first film layer, the first film layer and the second film layer are alternatively and repeatedly formed in the film stack, and the film stack has a local bow range less than 200 μm.
11. The method of claim 10 , wherein the first film layer is a silicon oxide layer, and the second film layer is a silicon nitride layer.
12. A method for forming a film layer on a substrate, comprising:
positioning a substrate on a substrate support in a process chamber, the substrate support having a concave substrate supporting surface or a convex substrate supporting surface in accordance with a compressive or tensile stress profile of the substrate;
flowing a deposition gas mixture comprising a silicon containing gas and a reacting pas to a process chamber through a showerhead;
forming a plasma in the presence of the deposition gas mixture in the process chamber by applying an RF power to multiple coupling points of the showerhead that are symmetrically arranged about a center point of the showerhead;
performing a deposition process while rotating the substrate to deposit a film layer on the substrate; and
tuning plasma density over the substrate by:
maintaining a first electrode at an outer zone of the substrate support at a first impedance and a second electrode at an inner zone of the substrate at a second impedance higher than the first impedance, if the center region of the substrate has a higher compressive stress than a compressive stress at an edge region of the substrate; or
maintaining the first electrode at the outer zone of the substrate support at a third impedance and the second electrode at the inner zone of the substrate at a fourth impedance lower than the third impedance, if the center region of the substrate has a less compressive stress than a compressive stress at the edge region of the substrate.
13. A method for forming a film layer on a substrate, comprising:
positioning a substrate on a substrate support in a process chamber, the substrate support having a concave substrate supporting surface or a convex substrate supporting surface in accordance with a compressive or tensile stress profile of the substrate;
flowing a deposition gas mixture comprising a silicon containing gas and a reacting gas to a process chamber through a showerhead having a convex surface facing the substrate support or a concave surface facing the substrate support in accordance with a compressive or tensile stress profile of the substrate;
forming a plasma in the presence of the deposition gas mixture in the process chamber by applying an RF power to multiple coupling points of the showerhead that are symmetrically arranged about a center point of the showerhead;
performing a deposition process while rotating the substrate to deposit a film layer on the substrate and tuning side-to-side or front-to-back plasma density over the substrate by adjusting a height of the substrate support; and
delivering the deposition gas mixture through a blocking plate disposed above the showerhead by:
flowing the deposition gas mixture through apertures at a center region of the blocking plate with a first density and apertures at an edge region of the blocking plate with a second density lower than the first density, if the center region of the substrate has a higher compressive stress than a compressive stress at the edge region of the substrate; or
flowing the deposition gas mixture through apertures at the center region of the blocking plate with a third density and apertures at the edge region of the blocking plate with a fourth density higher than the third density, if the center region of the substrate has a less compressive stress than a compressive stress at the edge region of the substrate.
14. The method of claim 13 , wherein the silicon containing gas includes at least one of silane, di-silane, silicon tetrafluoride, silicon tetrachloride, dichlorsilane, and tetraethyl orthosilicate; and wherein the reacting gas comprises at least one of an oxygen containing gas, a nitrogen containing gas, and a carbon containing gas.
15. The method of claim 13 , wherein the film layer is a film stack comprising a first film layer and a second film layer disposed on the first film layer, the first film layer and the second film layer are alternatively and repeatedly formed in the film stack, and the film stack has a local bow range less than 200 μm.
16. The method of claim 15 , wherein the first film layer is a silicon oxide layer, and the second film layer is a silicon nitride layer.
17. A method for forming a film layer on a substrate, comprising:
positioning a substrate on a substrate support in a process chamber, the substrate support having a concave substrate supporting surface or a convex substrate supporting surface in accordance with a compressive or tensile stress profile of the substrate;
flowing a deposition gas mixture comprising a silicon containing gas and a reacting pas to a process chamber through a showerhead having a convex surface facing the substrate support or a concave surface facing the substrate support in accordance with a compressive or tensile stress profile of the substrate;
forming a plasma in the presence of the deposition gas mixture in the process chamber by applying an RF power to multiple coupling points of the showerhead that are symmetrically arranged about a center point of the showerhead; and
performing a deposition process while rotating the substrate to deposit a film layer on the substrate and tuning side-to-side or front-to-back plasma density over the substrate by adjusting a height of the substrate support, and wherein the tuning the side-to-side or front-to-back plasma density over the substrate comprises:
maintaining a first electrode at an outer zone of the substrate support at a first impedance and a second electrode at an inner zone of the substrate at a second impedance higher than the first impedance, if the center region of the substrate has a higher compressive stress than a compressive stress at an edge region of the substrate; or
maintaining the first electrode at the outer zone of the substrate support at a third impedance and the second electrode at the inner zone of the substrate at a fourth impedance lower than the third impedance, if the center region of the substrate has a less compressive stress than a compressive stress at the edge region of the substrate.