Multi-mode surface acoustic wave filter

1. A multi-mode surface acoustic wave filter comprising:

a plurality of interdigital transducer electrodes including a first interdigital transducer electrode and a second interdigital transducer electrode, the first interdigital transducer electrode being longitudinally coupled to the second interdigital transducer electrode; and

acoustic reflectors on opposing sides of the plurality of interdigital transducer electrodes, the acoustic reflectors including acoustic reflector fingers arranged to suppress a spurious response due to shear horizontal mode of the multi-mode surface acoustic wave filter, the acoustic reflector fingers having slanted pitches and stepped lengths, and the multi-mode surface acoustic wave filter configured to filter a radio frequency signal.

2. The multi-mode surface acoustic wave filter of claim 1 wherein the acoustic reflectors on opposing sides of the plurality of interdigital transducer electrodes have different pitches than each other.

3. The multi-mode surface acoustic wave filter of claim 1 further comprising metal fill in an area where the acoustic reflector fingers have the stepped lengths.

4. The multi-mode surface acoustic wave filter of claim 1 wherein the slanted pitches include different spacings between different respective portions of adjacent acoustic reflector fingers of the acoustic reflectors.

5. The multi-mode surface acoustic wave filter of claim 1 further comprising:

a plurality of second interdigital transducer electrodes arranged in parallel with the plurality of interdigital transducer electrodes; and

second acoustic reflectors on opposing sides of the second interdigital transducer electrodes.

6. The multi-mode surface acoustic wave filter of claim 1 wherein the acoustic reflectors are symmetric about an aperture direction.

7. The multi-mode surface acoustic wave filter of claim 1 further comprising a temperature compensation layer and a piezoelectric layer, the temperature compensation layer being positioned over the plurality of interdigital transducer electrodes and the piezoelectric layer.

8. The multi-mode surface acoustic wave filter of claim 7 wherein the temperature compensation layer is a silicon dioxide layer.

9. The multi-mode surface acoustic wave filter of claim 1 further comprising a support substrate and a piezoelectric layer on the support substrate, the plurality of interdigital transducer electrodes being on and in physical contact with the piezoelectric layer.

10. The multi-mode surface acoustic wave filter of claim 1 wherein the first interdigital transducer electrode includes two metal layers.

11. A method of filtering a radio frequency signal with a multi-mode surface acoustic wave filter, the method comprising:

providing a radio frequency signal to the multi-mode surface acoustic wave filter;

filtering the radio frequency signal with the multi-mode surface acoustic wave filter, the multi-mode surface acoustic wave filter including a plurality of longitudinally coupled interdigital transducer electrodes and acoustic reflectors on opposing sides of the plurality of longitudinally coupled interdigital transducer electrodes, and the acoustic reflectors including acoustic reflector fingers having slanted pitches and stepped lengths; and

during the filtering, suppressing a spurious response due to shear a horizontal mode of the multi-mode surface acoustic wave filter with the acoustic reflectors of the multi-mode surface acoustic wave filter.

12. The method of claim 11 wherein the multi-mode surface acoustic wave filter includes a plurality of second interdigital transducer electrodes arranged in parallel with the plurality of longitudinally coupled interdigital transducer electrodes, and second acoustic reflectors on opposing sides of the second interdigital transducer electrodes.

13. The method of claim 11 wherein the acoustic reflectors are symmetric about an aperture direction.

14. A packaged module comprising:

a packaging substrate;

a radio frequency switch on the packaging substrate; and

a multi-mode surface acoustic wave filter on the packaging substrate, the multi-mode surface acoustic wave filter configured to filter a radio frequency signal provided by the radio frequency switch, the multi-mode surface acoustic wave filter including a plurality of longitudinally coupled interdigital transducer electrodes and acoustic reflectors on opposing sides of the plurality of longitudinally coupled interdigital transducer electrodes, the acoustic reflectors including acoustic reflector fingers having slanted pitches and stepped lengths, the acoustic reflector fingers arranged to suppress a spurious response due to shear horizontal mode of the multi-mode surface acoustic wave filter.

15. The packaged module of claim 14 wherein the multi-mode surface acoustic wave filter is included in a filter coupled to the radio frequency switch, the filter including a plurality of acoustic wave resonators coupled to the multi-mode surface acoustic wave filter.

16. The packaged module of claim 14 further comprising a radio frequency amplifier on the packaging substrate, the radio frequency amplifier coupled to the multi-mode surface acoustic wave filter.

17. The packaged module of claim 16 wherein radio frequency amplifier is a low noise amplifier.

18. The packaged module of claim 14 wherein the acoustic reflectors are symmetric about an aperture direction.

19. The packaged module of claim 14 wherein the multi-mode surface acoustic wave filter includes a plurality of second interdigital transducer electrodes arranged in parallel with the plurality of longitudinally coupled interdigital transducer electrodes, and second acoustic reflectors on opposing sides of the second interdigital transducer electrodes.

20. The packaged module of claim 14 wherein the multi-mode surface acoustic wave filter includes a temperature compensation layer and a piezoelectric layer, and the temperature compensation layer is positioned over the plurality of longitudinally coupled interdigital transducer electrodes and the piezoelectric layer.