Electronic device
An electronic device includes a housing and a buffer component. The housing has a corner portion and two side edges adjacent to the corner portion. The buffer component is embedded in the corner portion and includes a strengthened layer and a buffer layer. The strengthened layer includes an arc-shaped side edge and an embedded portion. The embedded portion is embedded in the corner portion, such that the arc-shaped side edge is aligned with the two side edges. The strengthened layer is a strengthened material structure. The buffer layer is disposed between the strengthened layer and the housing, and the buffer layer is an elastic material structure.
1. An electronic device, comprising:
a housing having a corner portion and two side edges adjacent to the corner portion;
a buffer component embedded in the corner portion, the buffer component comprising:
a strengthened layer comprising an arc-shaped side edge and an embedded portion, wherein the arc-shaped side edge is connected to the embedded portion, the embedded portion is embedded in the corner portion such that the arc-shaped side edge exposing from the housing covers the corner portion and is aligned with the two side edges, and the strengthened layer is a strengthened material structure;
a buffer layer disposed between the strengthened layer and the housing along a direction perpendicular to a plane in which the housing is located, and separating the strengthened layer from the housing, wherein the buffer layer is an elastic material structure; and another buffer layer, the buffer layer and the another buffer layer are respectively disposed on two opposite side surfaces of the strengthened layer;
wherein a distance between the strengthened layer and the housing is greater than a minimum thickness of the buffer layer after being compressed.
2. The electronic device according to claim 1 , wherein the buffer component further comprises an inner plate, the inner plate is disposed on a side surface of the another buffer layer relative to the strengthened layer and is configured to fix the buffer component to the housing.
3. The electronic device according to claim 2 , wherein the buffer component further comprises at least one locking screw, the at least one locking screw sequentially passes through the inner plate, the another buffer layer, and the strengthened layer to be locked to the housing.
4. The electronic device according to claim 1 , wherein the housing has a positioning rod extending in the direction perpendicular to the plane, the strengthened layer has a positioning hole correspondingly sleeved on the positioning rod, and the buffering layer extends between the positioning hole and the positioning rod.
5. The electronic device according to claim 1 , wherein the arc-shaped side edge of the strengthened layer and the two side edges of the housing are spatially separated from each other to form a gap.
6. The electronic device according to claim 1 , wherein a strength coefficient of the strengthened layer is greater than a strength coefficient of the housing, and an elastic coefficient of the buffer layer is greater than an elastic coefficient of the housing.
7. The electronic device according to claim 1 , wherein the strengthened layer comprises titanium, aluminum, and a liquid metal.
8. The electronic device according to claim 1 , wherein the buffer layer comprises rubber and plastic.