Printhead die assembly
A method may include positioning first and second printhead die within a die carrier, using a registration pin of the die carrier to align the first and second printhead die and fixing the position of the first and second printhead die within the die carrier.
1. A method for calibrating a printer, the method comprising:
positioning a first printhead die and a second printhead die back-to-back within a die carrier;
using a registration pin of the die carrier as a reference point to align nozzles of the first printhead die and the second printhead die such that centers of the nozzles of the first printhead die are spaced a first distance from the reference point provided by the registration pin and such that centers of the nozzles of the second printhead die are offset from the nozzles of the first printhead die, the nozzles of the second printhead die being spaced a second distance, different than the first distance, from the reference point provided by the registration pin; and
fixing the position of the first printhead die and the second printhead die within the die carrier, wherein the nozzles of the first printhead die and the second printed die face in a first direction, wherein the first printhead die and the second printhead die have abutting faces extending in first and second parallel planes and wherein the registration pin extends along an axis parallel to the first direction and parallel to the first and second parallel planes, the registration pin being intersected by the first and second parallel planes.
2. The method of claim 1 , wherein fixing the position of the first printhead die and the second printhead die within the die carrier includes applying an adhesive to the first printhead die, the second printhead die and the die carrier.
3. The method of claim 1 , further comprising applying a layer of adhesive between the first and second printhead die.
4. The method of claim 1 , wherein the first printhead die and the second printhead die are aligned by:
acquiring a position of each of the first and second printhead die relative to the registration pin using an optics tool that carries out image processing; and
controlling movement of a motorized stage coupled to a micro gripper based upon the acquired position of each of the first and second printhead die relative to the registration pin.
5. The method of claim 1 , wherein the first printhead die and the second printhead die are manufactured from a silicon wafer.
6. The method of claim 1 , wherein the die carrier provides electrical and fluidic connections to the first printhead die and the second printhead die.