Methods of Manufacturing Printed Circuit Boards
Please move the Abstract from the first page of the published international application (International Publication No. WO 2017/011703) to the end of the present application, immediately following the claims.
1 - 24 . (canceled)
25 . A covered laminated printed circuit board subassembly, comprising:
a laminated printed circuit board subassembly including a plurality of layered subassemblies, a top surface, a bottom surface and a plurality of vias electrically interconnecting certain of the layered subassemblies;
each of the plurality of vias including a top surface opening in the top surface arid a bottom surface opening in the bottom surface; and,
a removable polymer film material adhering to one of the group consisting of the top surface, the bottom surface and the top surface and the bottom surface; wherein any polymer film material adhering to the top surface, the bottom surface or the top surface and the bottom surface which is proximate any one of the plurality of top surface openings or bottom openings in the top surface or the bottom surface includes a hole proximate each of such openings designed to facilitate depositing hole-fill paste in each of the plurality vias.
26 . The covered laminated printed circuit board subassembly of claim 25 , wherein the removable polymer film material further comprises adhesive backing, and the adhesive backing is oriented toward and is in contact with at least one of the top surface and the bottom surface of the laminated printed circuit board subassembly, thereby adhering the removable polymer film material to at least one of the top surface and the bottom surface of the laminated printed circuit board subassembly.
27 . The covered laminated printed circuit board subassembly of claim 26 , wherein a sheet of the removable polymer film material is adhered to each of the top surface and the bottom surface.
28 - 38 . (canceled)