Deposited material structure with integrated component
A method for forming a metallic structure having a secondary component includes positioning the secondary component on a main formation surface of a main tool, the main formation surface corresponding to a desired shape of a first layer of material. The method also includes depositing a layer of material on the secondary component and the main formation surface using a cold-spray technique such that the layer of material bonds to the secondary component. The method also includes removing the layer of material and the secondary component to form the metallic structure.
1. A system for forming a metallic structure having a secondary component, comprising:
a main tool having a main formation surface corresponding to a desired shape of the metallic structure and a secondary tool having a secondary shape corresponding to the secondary component;
the secondary component configured to be positioned in a volume defined by the main formation surface and the volume having the secondary shape corresponding to the secondary component, the secondary component having a tool surface configured to contact the main formation surface that defines the volume;
a cold-spray gun configured to output a gas including particles of a material towards the main formation surface, the secondary component, and the secondary tool at a velocity sufficiently great to cause the particles of the material to bond together and to the secondary component on the main formation surface to form a layer of material resulting in the metallic structure with the secondary component attached thereto, wherein the layer of material and the secondary component are removed from the main tool to form the metallic structure;
wherein the secondary tool is configured to be positioned on the secondary component such that the cold-spray gun is configured to deposit at least a portion of the layer of material on the secondary tool; and
a device for removing the secondary tool.
2. The system of claim 1 , wherein the secondary component has a bonding surface configured to receive the layer of material, the bonding surface being textured to enhance bonding with the layer of material.
3. The system of claim 2 , wherein the device for removing the secondary tool is configured to form a space between at least a portion of the secondary component and the layer of material.
4. The system of claim 3 , further comprising a hole-forming device configured to form a hole in the layer of material wherein the device for removing the secondary tool is configured to remove the secondary tool via the hole in the layer of material.
5. The system of claim 1 , wherein the metallic structure is a sheet structure having a surface area of at least 1 inch squared.
6. The system of claim 1 , wherein the main tool comprises a metal, a plastic, nylon, polymers, high-temperature resins, aluminum, or low melt alloys.
7. The system of claim 1 , wherein a portion of the main formation surface is removed to form one or more recess in the main formation surface.
8. The system of claim 1 , further comprising a releasing agent configured to be applied between the metallic structure and the main tool to facilitate release of the metallic structure from the main formation surface.
9. The system of claim 1 , wherein the secondary component comprises a base positioned proximate to the metallic structure and an outer end positioned distal to the metallic structure.