Double-sided cooling package of inductor
Embodiments of the disclosure relate to apparatuses for enhanced thermal management of a planar inductor assembly. In one embodiment, a cooling package for an inductor assembly includes a cold plate and a heat-spreading bracket mechanically coupled to the cold plate at a first end of the heat-spreading bracket. The cold plate has a slotted recess for mounting a first inductor core along a first end thereof. The heat-spreading bracket is configured to apply a clamping force to a second inductor core at a second end opposite to the first end of the heat-spreading bracket.
1. A cooling package for an inductor assembly comprising:
a cold plate having a slotted recess comprising a pair of opposing open sides, the slotted recess configured for mounting a first inductor core along a first end thereof; and
a heat-spreading bracket mechanically coupled to the cold plate at a first end with at least one mechanical fastener and configured to apply a clamping force to a second inductor core at a second end opposite to the first end of the heat-spreading bracket.
2. The cooling package of claim 1 , wherein the slotted recess is shaped as a rectangular notch.
3. The cooling package of claim 1 , wherein the heat-spreading bracket comprises a material selected from one of: graphite, a metal, an alloy and a polymer having thermal conductivity greater than 100 W/m*K.
4. The cooling package of claim 1 , wherein the heat-spreading bracket comprises an embedded heat pipe having a condenser section proximate to the cold plate and an evaporator section proximate to the second inductor core.
5. The cooling package of claim 1 , wherein the heat-spreading bracket has a sloping surface between the first end and the second end such that the second end is positioned at a greater distance with respect to the cold plate than the first end.
6. The cooling package of claim 1 , wherein the heat-spreading bracket has a shape designed using a topology optimization method, where a mean temperature at an interface between the second inductor core and the heat-spreading bracket is optimized subject to a solid material volume constraint.
7. The cooling package of claim 1 , wherein the heat-spreading bracket has a shape designed using a topology optimization method, where a mean deflection due to clamping force at an interface between the second inductor core and the heat-spreading bracket is optimized subject to a solid material volume constraint.
8. The cooling package of claim 1 further comprising a shim layer between the second inductor core and the heat-spreading bracket, wherein the shim layer comprises a glass-reinforced epoxy laminate or a ceramic material.
9. The cooling package of claim 1 , wherein the heat-spreading bracket has a first planar portion proximate to the first end, a second planar portion proximate to the second end and a sloping portion between the first planar portion and the second planar portion.
10. The cooling package of claim 1 , wherein the heat-spreading bracket has a dome-shaped portion between the first end and the second end.
11. An inductor assembly comprising:
a cold plate having a slotted recess comprising a pair of opposing open sides;
a first inductor core mounted to the cold plate through the slotted recess along a first end of the first inductor core;
a printed circuit board (PCB) disposed over the first inductor core and having one or more apertures therethrough, wherein a second end of the first inductor core protrudes through the one or more apertures and the second end of the first inductor core is opposite to the first end of the inductor core;
a second inductor core disposed on the second end of the first inductor core; and
a heat-spreading bracket mechanically coupled to the cold plate at a first end with at least one mechanical fastener and applying a clamping force to the second inductor core at a second end opposite to the first end of the heat-spreading bracket.
12. The inductor assembly of claim 11 , wherein the first inductor core is E-shaped and the second inductor core is I-shaped or E-shaped.
13. The inductor assembly of claim 11 , wherein the heat-spreading bracket comprises a material selected from one of: graphite, a metal, an alloy and a polymer having thermal conductivity greater than 100 W/m*K.
14. The inductor assembly of claim 11 , wherein the heat-spreading bracket comprises an embedded heat pipe having a condenser section proximate to the cold plate and an evaporator section proximate to the second inductor core.
15. The inductor assembly of claim 11 , wherein the heat-spreading bracket has a sloping surface between the first end and the second end such that the second end is positioned at a greater distance with respect to the cold plate than the first end.
16. The inductor assembly of claim 11 , wherein the heat-spreading bracket has a shape designed using a topology optimization method, where a mean temperature at an interface between the second inductor core and the heat-spreading bracket is optimized subject to a solid material volume constraint.
17. The inductor assembly of claim 11 , wherein the heat-spreading bracket has a shape designed using a topology optimization method, where a mean deflection due to clamping force at an interface between the second inductor core and the heat-spreading bracket is optimized subject to a solid material volume constraint.
18. The inductor assembly of claim 11 , wherein the first inductor core and the second inductor core are separated by an electrically-isolating spacer.
19. The inductor assembly of claim 11 further comprising a shim layer between the cold plate and the PCB, wherein the shim layer comprises a glass-reinforced epoxy laminate or a ceramic material.
20. The inductor assembly of claim 11 further comprising a shim layer between the second inductor core and the heat-spreading bracket, wherein the shim layer comprises a glass-reinforced epoxy laminate or a ceramic material.