IP Library Granted Patent US 11,761,114
Granted Patent B2
US 11,761,114 · App. 16/693,682 · Granted Sep 19, 2023

Method of producing SiC single crystal ingot

Inventor: Yohei Fujikawa (Hikone, JP)
Assignee: Resonac Corporation
C30B23/066C30B29/36C30B35/002
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,761,114
App. No.
16/693,682
Granted
Sep 19, 2023
Kind
B2
Abstract

In a method of producing a SiC single crystal ingot of the present invention, in a lower part of a crucible, a high thermal conductivity raw material layer containing a high thermal conductivity raw material and a low thermal conductivity raw material layer containing a low thermal conductivity raw material in at least one of a position above or below the high thermal conductivity raw material layer are disposed to form a raw material part, and heating is performed so that the raw material part reaches the maximum temperature in the high thermal conductivity raw material layer and a SiC single crystal ingot is grown.

Claims (17)

1. A method of producing a SiC single crystal ingot, comprising:

in a lower part of a crucible, forming a raw material part by disposing a high thermal conductivity raw material layer containing a high thermal conductivity raw material formed of SiC and a low thermal conductivity raw material layer containing a low thermal conductivity raw material formed of SiC in a position above or below the high thermal conductivity raw material layer;

adjusting a position of a heating unit in a vertical direction such that a point of maximum temperature is within the high thermal conductivity raw material layer; and

heating an inside of the crucible to a temperature of 2,000° C. to 2,500° C., sublimating the raw material and growing the SiC single crystal ingot,

wherein a thickness of the high thermal conductivity raw material layer is 2 to 10 times a thickness of the low thermal conductivity raw material layer.

2. The method of producing a SiC single crystal ingot according to claim 1 ,

wherein high thermal conductivity raw material particles constituting the high thermal conductivity raw material layer have a larger particle size than low thermal conductivity raw material particles constituting the low thermal conductivity raw material layer.

3. The method of producing a SiC single crystal ingot according to claim 1 ,

wherein the high thermal conductivity raw material layer has a lower porosity than the low thermal conductivity raw material layer.

4. The method of producing a SiC single crystal ingot according to claim 1 ,

wherein an insulating material is disposed on the bottom in the crucible.

5. The method of producing a SiC single crystal ingot according to claim 1 ,

wherein an insulating material is disposed outside the bottom of the crucible.

6. The method of producing a SiC single crystal ingot according to claim 1 ,

wherein the high thermal conductivity raw material particles have a particle size of 300 μm or more and 800 μm or less.

7. The method of producing a SiC single crystal ingot according to claim 1 ,

wherein the low thermal conductivity raw material layer is disposed above and below the high thermal conductivity raw material layer to form the raw material part.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 25, 2019
From: FUJIKAWA, YOHEI
To: SHOWA DENKO K.K.
Reel/Frame 051105/0101 →