Semiconductor structures including standard cells and tap cells

1. A semiconductor structure, comprising:

a first cell disposed over a first well doped with a first-type dopant, the first cell comprising a first plurality of transistors;

a second cell disposed over the first well, the second cell comprising a second plurality of transistors; and

a tap cell disposed over a second well doped with a second-type dopant different from the first-type dopant, the tap cell being sandwiched between the first cell and the second cell,

wherein the first cell comprises a first active region disposed directly over the first well, the tap cell comprises a third active region disposed directly over the second well, and the first active region and the third active region are portions of a continuous active region.

2. The semiconductor structure of claim 1 ,

wherein the second cell comprises a second active region aligned with the first active region.

3. The semiconductor structure of claim 2 , wherein the first-type dopant is n-type and the second-type dopant is p-type.

4. The semiconductor structure of claim 2 , wherein the first-type dopant is p-type and the second-type dopant is n-type.

5. The semiconductor structure of claim 1 , wherein the first well comprises a first shape that includes a base portion and at least one letter-shaped branch extending from the base portion.

6. The semiconductor structure of claim 5 , wherein the second well comprises a second shape keyed to the first shape.

7. The semiconductor structure of claim 5 , wherein each of the at least one letter-shaped branch is a T-shape portion.

8. A semiconductor structure, comprising:

a substrate;

a first well in the substrate, the first well being doped with a first-type dopant;

a second well in the substrate, the second well being doped with a second-type dopant different from the first-type dopant; and

a first tap cell and a second tap cell,

wherein a portion of the first well extends into the second well, and a portion of the second well extends into the first well,

wherein three sides of the portion of the first well border the second well, and

wherein the first tap cell is disposed over the portion of the first well, and the second tap cell is disposed over the portion of the second well.

9. The semiconductor structure of claim 8 ,

wherein the first well comprises a base portion and a first T-shape portion coupled to the base portion via a first vertical bar portion of the first T-shape portion,

wherein the portion of the first well is the first T-shape portion.

10. The semiconductor structure of claim 9 ,

wherein the second well comprises a T-shape opening,

wherein the first T-shape portion of the first well substantially fits in the T-shape opening.

11. The semiconductor structure of claim 9 ,

wherein the first T-shape portion further comprises a first horizontal bar portion coupled to the first vertical bar portion,

wherein the first tap cell is disposed directly over the first vertical bar portion of the first T-shape portion.

12. The semiconductor structure of claim 11 ,

wherein the second well comprises a second T-shape portion,

wherein the second T-shape portion comprises a second vertical bar portion and a second horizontal bar portion coupled to the second vertical bar portion,

wherein the semiconductor structure further comprises a first standard cell over the second horizontal bar portion,

wherein the first standard cell comprises a plurality of transistors.

13. The semiconductor structure of claim 12 ,

wherein the first tap cell includes a first active region,

wherein the first standard cell includes a second active region,

wherein the first active region is aligned with the second active region.

14. The semiconductor structure of claim 12 , wherein the first tap cell is spaced apart from the first standard cell by at least one dielectric feature that extends into the first well.

15. The semiconductor structure of claim 12 , wherein the first tap cell is spaced apart from the first standard cell by at least one dielectric feature that extends into the second well.

16. The semiconductor structure of claim 9 , wherein the first well further comprises an L-shape portion coupled to the base portion.

17. A semiconductor structure, comprising:

a substrate;

a first cell disposed over an n-type well, the first cell comprising a first plurality of transistors;

a second cell disposed over the n-type well, the second cell comprising a second plurality of transistors; and

a tap cell disposed over a p-type well, the tap cell being sandwiched between the first cell and the second cell; and

at least one dielectric feature including an upper portion disposed over the n-type well and a lower portion extending into the n-type well,

wherein the first cell comprises a first active region, and the first active region is spaced apart from the tap cell by the at least one dielectric feature.

18. The semiconductor structure of claim 17 ,

wherein the tap cell comprises a second active region,

wherein the first active region and the second active region are aligned.

19. The semiconductor structure of claim 18 , wherein the first active region is not spaced apart from the tap cell by a shallow trench isolation feature.

20. The semiconductor structure of claim 17 , further comprising at least one another dielectric feature that extends into the p-type well,

wherein the tap cell comprises a second active region,

wherein the first active region and the second active region are aligned,

wherein the first active region is spaced apart from the tap cell by the at least one another dielectric feature.