Metal contactless smart card and method for fabricating the same
View Patent ↗A metal contactless smart card includes a first metal layer having a first slit, a second layer, a radio-frequency integrated circuit chip module, and an inlay having an antenna. A nonconductive insert may be fitted in the slit. The first metal layer may include an inlay recess where the inlay may be received and a through-hole where the chip may be inserted. The second layer of the smart card may be made of metal and may also include a slit.
1. A smart card for financial transactions comprising:
a radio-frequency integrated circuit (RFIC) chip module having a RFIC chip;
an antenna to enable contactless communication of the RFIC chip module with an external reader;
a first metal layer having a through-hole in which the RFIC chip module is inserted;
a first slit formed in the first metal layer and disposed from the through-hole to an outer edge of the first metal layer; and
an insert having a shape corresponding to the first slit, wherein the insert comprises a rod-shaped body, having a length dimension corresponding to a length extending from the through-hole to the outer edge of the first metal layer, with a left wing and a right wing.
2. The smart card of claim 1 , wherein the first metal layer includes a recess in which the antenna is received.
3. The smart card of claim 2 , wherein the recess surrounds the through-hole.
4. The smart card of claim 1 , further comprising a second layer attached to a lower side of the first metal layer.
5. The smart card of claim 4 , wherein the antenna is located in between the first metal layer and the second layer.
6. The smart card of claim 4 , wherein the second layer is made of a synthetic resin.
7. The smart card of claim 4 , wherein the second layer is metallic and comprises a second slit, and
wherein the second slit is disposed from an interior portion of the second layer to an edge of the second layer.
8. The smart card of claim 7 , wherein the second slit is disposed to be substantially aligned with the first slit.
9. The smart card of claim 8 , wherein a cross-sectional profile of the first slit is wider on the lower side of the first metal layer than an upper side of the first metal layer.
10. The smart card of claim 1 , wherein the first slit is at least 0.1 mm in width.
11. The smart card of claim 1 , wherein a cross-sectional profile of the first slit is wider on a lower side of the first metal layer than an upper side of the first metal layer.