Display device and method of manufacturing the same
A method of manufacturing a display device includes the following steps. A bonding pad is formed on a dielectric layer. A light-shielding material is formed on the dielectric layer. A temperature of the light-shielding material is increased such that the light-shielding material is cured into a light-shielding layer. During curing the light-shielding material into the light-shielding layer, the light-shielding material flows to and contacts a portion of a surface of the bonding pad. A light-emitting element is electrically connected to the bonding pad.
1. A method of manufacturing a display device, comprising: forming a bonding pad on a dielectric layer; forming a light-shielding material on the dielectric layer; increasing a temperature of the light-shielding material such that the shielding material is cured into a light-shielding layer, wherein during curing the light-shielding material into the light-shielding layer, the light-shielding material flows to and contacts a portion of a surface of the bonding pad; and electrically connecting a light-emitting element to the bonding pad.
2. The method of manufacturing the display device of claim 1 , wherein increasing the temperature of the light-shielding material is performed after forming the bonding pad and before electrically connecting the light-emitting element to the bonding pad.
3. The method of manufacturing the display device of claim 1 , wherein during curing the light-shielding material into the light-shielding layer, the light-shielding material flows to and contacts a portion of a surface of the light-emitting element.
4. The method of manufacturing the display device of claim 1 , wherein the temperature of the light-shielding material is increased such that the temperature of the light-shielding material is in a range from 180° C. to 250° C.