Fin smoothing and integrated circuit structures resulting therefrom
Fin smoothing, and integrated circuit structures resulting therefrom, are described. For example, an integrated circuit structure includes a semiconductor fin having a protruding fin portion above an isolation structure, the protruding fin portion having substantially vertical sidewalls. The semiconductor fin further includes a sub-fin portion within an opening in the isolation structure, the sub-fin portion having a different semiconductor material than the protruding fin portion. The sub-fin portion has a width greater than or less than a width of the protruding portion where the sub-fin portion meets the protruding portion. A gate stack is over and conformal with the protruding fin portion of the semiconductor fin. A first source or drain region at a first side of the gate stack, and a second source or drain region at a second side of the gate stack opposite the first side of the gate stack.
1. An integrated circuit structure, comprising:
a semiconductor fin having a protruding fin portion above an isolation structure, the protruding fin portion having substantially vertical sidewalls, and the semiconductor fin further comprising a sub-fin portion within an opening in the isolation structure, the sub-fin portion comprising a different semiconductor material than the protruding fin portion, wherein the sub-fin portion has a width greater than a width of the protruding portion where the sub-fin portion meets the protruding portion;
a gate stack over and conformal with the protruding fin portion of the semiconductor fin;
a first source or drain region at a first side of the gate stack; and
a second source or drain region at a second side of the gate stack opposite the first side of the gate stack.
2. The integrated circuit structure of claim 1 , wherein the sub-fin portion comprises silicon, and the protruding fin portion comprises silicon and germanium.
3. The integrated circuit structure of claim 2 , wherein the protruding fin portion comprises Si 70 Ge 30 .
4. The integrated circuit structure of claim 1 , wherein the sub-fin portion meets the protruding portion at a location co-planar with a top surface of the isolation structure.
5. The integrated circuit structure of claim 1 , wherein the sub-fin portion is on a monocrystalline silicon substrate.
6. The integrated circuit structure of claim 1 , wherein the first and second source or drain regions are embedded source or drain regions.
7. The integrated circuit structure of claim 1 , wherein the first and second source or drain regions are formed in regions of the semiconductor fin at the first and second sides of the gate stack, respectively.
8. The integrated circuit structure of claim 1 , wherein the gate stack comprises a gate dielectric comprising a high-k dielectric material, and a gate electrode comprising a metal.
9. An integrated circuit structure, comprising:
a semiconductor fin having a protruding fin portion above an isolation structure, the protruding fin portion having substantially vertical sidewalls, and the semiconductor fin further comprising a sub-fin portion within an opening in the isolation structure, the sub-fin portion comprising a different semiconductor material than the protruding fin portion, wherein the sub-fin portion has a width less than a width of the protruding portion where the sub-fin portion meets the protruding portion;
a gate stack over and conformal with the protruding fin portion of the semiconductor fin;
a first source or drain region at a first side of the gate stack; and
a second source or drain region at a second side of the gate stack opposite the first side of the gate stack.
10. The integrated circuit structure of claim 9 , wherein the sub-fin portion comprises silicon, and the protruding fin portion comprises silicon and germanium.
11. The integrated circuit structure of claim 10 , wherein the protruding fin portion comprises Si 70 Ge 30 .
12. The integrated circuit structure of claim 9 , wherein the sub-fin portion meets the protruding portion at a location co-planar with a top surface of the isolation structure.
13. The integrated circuit structure of claim 9 , wherein the sub-fin portion is on a monocrystalline silicon substrate.
14. The integrated circuit structure of claim 9 , wherein the first and second source or drain regions are embedded source or drain regions.
15. The integrated circuit structure of claim 9 , wherein the first and second source or drain regions are formed in regions of the semiconductor fin at the first and second sides of the gate stack, respectively.
16. The integrated circuit structure of claim 9 , wherein the gate stack comprises a gate dielectric comprising a high-k dielectric material, and a gate electrode comprising a metal.
17. A computing device, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a semiconductor fin having a protruding fin portion above an isolation structure, the protruding fin portion having substantially vertical sidewalls, and the semiconductor fin further comprising a sub-fin portion within an opening in the isolation structure, the sub-fin portion comprising a different semiconductor material than the protruding fin portion, wherein the sub-fin portion has a width greater than or less than a width of the protruding portion
where the sub-fin portion meets the protruding portion;
a gate stack over and conformal with the protruding fin portion of the semiconductor fin;
a first source or drain region at a first side of the gate stack; and
a second source or drain region at a second side of the gate stack opposite the first side of the gate stack.
18. The computing device of claim 17 , further comprising:
a memory coupled to the board.
19. The computing device of claim 17 , further comprising:
a camera coupled to the board.
20. The computing device of claim 17 , further comprising:
a battery coupled to the board.
21. The computing device of claim 17 , wherein the component is a packaged integrated circuit die.
22. The computing device of claim 17 , wherein the component is selected from the group consisting of a processor, a communications chip, and a digital signal processor.
23. The computing device of claim 17 , wherein the computing device is selected from the group consisting of a mobile phone, a laptop, a desk top computer, a server, and a set-top box.