IP Library Granted Patent US 11,444,597
Granted Patent B2
US 11,444,597 · App. 16/701,206 · Granted Sep 13, 2022

Acoustic wave filter device

Inventor: Motoki Ozasa (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H03H9/02952H03H9/6433H03H9/725
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Quick Facts
Patent No.
US 11,444,597
App. No.
16/701,206
Granted
Sep 13, 2022
Kind
B2
Abstract

An acoustic wave filter device includes first and second acoustic wave filters provided on a piezoelectric substrate, an insulating layer that is provided on the piezoelectric substrate and has a smaller dielectric constant than the piezoelectric substrate, a first wiring conductor electrically connected to an electrode of the first acoustic wave filter, a second wiring conductor electrically connected to an electrode of the second acoustic wave filter, the first wiring conductor and the second wiring conductor facing each other on the insulating layer in plan view, and a ground conductor located between the insulating layer and the piezoelectric substrate in a region A circumscribing the first wiring conductor and the second wiring conductor on the insulating layer in plan view.

Claims (34)

1. An acoustic wave filter device comprising:

a first acoustic wave filter and a second acoustic wave filter provided on a piezoelectric substrate;

an insulating layer that is provided on the piezoelectric substrate and has a smaller dielectric constant than the piezoelectric substrate;

a first wiring conductor electrically connected to an electrode of the first acoustic wave filter;

a second wiring conductor electrically connected to an electrode of the second acoustic wave filter, the first wiring conductor and the second wiring conductor facing each other on the insulating layer in plan view; and

a ground conductor located between the insulating layer and the piezoelectric substrate in a region circumscribing the first wiring conductor and the second wiring conductor on the insulating layer in plan view; wherein

a portion of the first wiring conductor and a portion of the second wiring conductor are arranged at different steps.

2. The acoustic wave filter device according to claim 1 , wherein the first acoustic wave filter includes two series resonators and two longitudinally coupled resonators that are electrically connected between an input terminal of the acoustic wave filter device and an output terminal of the acoustic wave filter device.

3. The acoustic wave filter device according to claim 2 , wherein each of the two series resonators is a surface acoustic wave resonator that is provided on the piezoelectric substrate and includes a pair of interdigital transducer electrodes.

4. The acoustic wave filter device according to claim 2 , wherein each of the two longitudinally coupled resonators is provided on the piezoelectric substrate and includes three pairs of interdigital transducer electrodes and a pair of reflectors sandwiching the three pairs of interdigital transducer electrodes.

5. The acoustic wave filter device according to claim 1 , wherein the second acoustic wave filter includes a series resonator and two longitudinally coupled resonators that are electrically connected between an input terminal of the acoustic wave filter device and an output terminal of the acoustic wave filter device.

6. The acoustic wave filter device according to claim 5 , wherein the second acoustic wave filter further includes a parallel resonator connected between a path connecting the two longitudinally coupled resonators and the output terminal and a ground terminal.

7. The acoustic wave filter device according to claim claim 6 , wherein each of the series resonator and the parallel resonator is a surface acoustic wave resonator that is provided on the piezoelectric substrate and includes a pair of interdigital transducer electrodes.

8. The acoustic wave filter device according to claim 5 , wherein each of the two longitudinally coupled resonators is provided on the piezoelectric substrate and includes three pairs of interdigital transducer electrodes and a pair of reflectors sandwiching the three pairs of interdigital transducer electrodes.

9. The acoustic wave filter device according to claim 1 , wherein the ground conductor, the insulating layer, the first wiring conductor, and the second wiring conductor are laminated in this order on a first main surface of the piezoelectric substrate.

10. The acoustic wave filter device according to claim 9 , wherein input terminals of the first and second acoustic wave filters, output terminals of the first and second acoustic wave filters, and a ground terminal are provided on a second main surface of the piezoelectric substrate.

11. The acoustic wave filter device according to claim 1 , wherein at least a portion of the ground conductor is provided in a gap portion between the first wiring conductor and the second wiring conductor in the region in plan view.

12. The acoustic wave filter device according to claim 1 , wherein the ground conductor is integrally provided in a region from a portion overlapping the first wiring conductor to a portion overlapping the second wiring conductor in plan view.

13. The acoustic wave filter device according to claim 1 , wherein the insulating layer includes a notch between the first wiring conductor and the second wiring conductor on an upper surface of the insulating layer.

14. The acoustic wave filter device according to claim 1 , wherein a portion of the insulating layer overlapping the first wiring conductor in plan view and a portion of the insulating layer overlapping the second wiring conductor in plan view have different thicknesses.

15. The acoustic wave filter device according to claim 1 , wherein pass bands of the first acoustic wave filter and the second acoustic wave filter at least partly overlap each other.

16. The acoustic wave filter device according to claim 1 , wherein one ends of the first acoustic wave filter and the second acoustic wave filter are electrically connected to each other.

17. The acoustic wave filter device according to claim 1 , wherein the first acoustic wave filter and the second acoustic wave filter are each an unbalanced-input-unbalanced-output band pass filter.

18. The acoustic wave filter device according to claim 1 , wherein

the first wiring conductor and the second wiring conductor are provided on an upper surface of the insulating layer;

a notch is provided in the upper surface of the insulating layer; and

the notch separates the first wiring conductor from the second wiring conductor.

19. An acoustic wave filter device comprising:

a first acoustic wave filter and a second acoustic wave filter provided on a piezoelectric substrate;

an insulating layer that is provided on the piezoelectric substrate and has a smaller dielectric constant than the piezoelectric substrate;

a first wiring conductor electrically connected to an electrode of the first acoustic wave filter;

a second wiring conductor electrically connected to an electrode of the second acoustic wave filter, the first wiring conductor and the second wiring conductor facing each other on the insulating layer in plan view; and

a ground conductor located between the insulating layer and the piezoelectric substrate in a region circumscribing the first wiring conductor and the second wiring conductor on the insulating layer in plan view; wherein

a portion of the insulating layer directly overlapping the first wiring conductor in plan view and a portion of the insulating layer directly overlapping the second wiring conductor in plan view have different thicknesses.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2019
From: OZASA, MOTOKI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 051158/0457 →
Priority Claims (1)
JP JP2017-110574 · Jun 5, 2017 · national
Continuity (2)
Continuation PCTJP2018020993 · May 31, 2018
Related Publication 20200106417A1 · Apr 2, 2020