IP Library › Granted Patent US 10,983,653
Granted Patent B2
US 10,983,653 · App. 16/701,766 · Granted Apr 20, 2021

Conductive film, touch panel, and method for manufacturing conductive film

Inventor: Kensuke Katagiri (Kanagawa, JP)
Assignee: FUJIFILM Corporation
G06F3/047G03C1/047H01B5/14H01B13/00G03F7/16G03F7/20G03F7/30G06F2203/04112
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Quick Facts
Patent No.
US 10,983,653
App. No.
16/701,766
Granted
Apr 20, 2021
Kind
B2
Abstract

A conductive film includes a support, detection electrodes that are arranged on at least one main surface of the support, connection portions that are arranged on the main surface so as to be electrically connected to an external terminal, and lead-out wirings that are arranged on the main surface, electrically connected to the detection electrodes through one end portion thereof, and electrically connected to the connection portions through the other end portion thereof, in which the connection portions contain a binder and a metal component, and a content of the metal component in the connection portions that is determined by X-ray photoelectron spectroscopy is 0.5 to 10 at %.

Claims (25)

1. A conductive film comprising:

a support;

detection electrodes that are arranged on at least one main surface of the support;

connection portions that are arranged on the main surface so as to be electrically connected to an external terminal; and

lead-out wirings that are arranged on the main surface, electrically connected to the detection electrodes through one end portion thereof, and electrically connected to the connection portions through the other end portion thereof,

wherein the connection portions contain a binder and a metal component, and

a content of the metal component in the connection portions that is determined by X-ray photoelectron spectroscopy is 0.5 to 10 at %.

2. The conductive film according to claim 1 ,

wherein at least one kind of member selected from the group consisting of the lead-out wirings and the detection electrodes further contains the binder and the metal component.

3. The conductive film according to claim 1 ,

wherein the detection electrodes are formed of mesh-like conductive thin wires containing the binder and the metal component.

4. The conductive film according to claim 1 ,

wherein the metal component contains at least one kind of atom selected from the group consisting of gold, silver, copper, nickel, palladium, tungsten, molybdenum, and chromium.

5. The conductive film according to claim 1 ,

wherein an area ratio of the metal component in a cross section of the connection portions ranging from a surface of the connection portions to a position 5 nm below the surface in a thickness direction is 0.5% to 8%.

6. The conductive film according to claim 2 ,

wherein the detection electrodes are formed of mesh-like conductive thin wires,

wherein the connection portions and lead-out wirings and the detection electrodes contain a binder and a metal component which contains at least one kind of atom selected from the group consisting of gold, silver, copper, nickel, palladium, tungsten, molybdenum, and chromium, and

wherein an area ratio of the metal component in a cross section of the connection portions ranging from a surface of the connection portions to a position 5 nm below the surface in a thickness direction is 0.5% to 8%.

7. A touch panel comprising:

the conductive film according to claim 1 .

8. A method for manufacturing the conductive film according to claim 1 in which the binder contains a polymer and the metal component contains metal silver, the method comprising:

a step of forming a silver halide-containing photosensitive layer by coating a support with a silver halide-containing coating solution, which contains silver halide, gelatin, and a polymer different from the gelatin, and a compositionally prepared coating solution, which contains a polymer different from the gelatin, by simultaneous multilayer coating;

a step of forming silver-containing connection portions by exposing the silver halide-containing photosensitive layer and then performing a development treatment on the photosensitive layer; and

a step of obtaining the conductive film by removing the gelatin from the connection portions.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2019
From: KATAGIRI, KENSUKE
To: FUJIFILM CORPORATION
Reel/Frame 051164/0093 →
Priority Claims (1)
JP JP2017-156508 · Aug 14, 2017 · national
Continuity (2)
Continuation PCTJP2018027472 · Jul 23, 2018
Related Publication 20200103996A1 · Apr 2, 2020