Multipass transfer surface for dynamic assembly
A method of manufacturing an intermediate transfer surface includes depositing an array of etch stops on a conductive surface, etching the conductive surface to form mesas of the conductive surface separated by gaps, and coating the mesas with a dielectric coating. A method of performing microassembly includes forming an assembly of particles on an assembly plane, providing an intermediate transfer surface having an array of electrodes, applying a bias to the intermediate transfer surface to form an electrostatic field between the assembly plane and the intermediate transfer surface, and moving the intermediate transfer surface towards the assembly surface until the electrostatic field strength is strong enough to cause transfer of the assembly to the intermediate transfer surface.
1. A method of performing microassembly, comprising:
forming an assembly of particles on an assembly plane;
providing an intermediate transfer surface having an array of electrodes;
applying a bias to the array of electrodes of the intermediate transfer surface to form an electrostatic field between the assembly plane and the intermediate transfer surface; and
moving the intermediate transfer surface towards the assembly plane until the intermediate transfer surface reaches at a distance equal to a space between electrodes on the intermediate transfer surface so that the electrostatic field strength is strong enough to cause transfer of the assembly of particles to the intermediate transfer surface.
2. The method as claimed in claim 1 , further comprising applying a second bias to the assembly plane to hold the assembly of particles in place.
3. The method as claimed in claim 2 , further comprising reversing the second bias to repel the particles from the assembly plane as the intermediate transfer surface moves towards the assembly plane.
4. The method as claimed in claim 2 , further comprising reducing the second bias as the intermediate transfer surface moves towards the assembly plane.
5. The method as claimed in claim 2 , further comprising increasing the bias applied to the intermediate transfer surface as the intermediate transfer surface moves towards the assembly plane.
6. The method as claimed in claim 1 , wherein the particles are uncharged on the assembly plane and the transfer occurs dielectrophoretically.
7. The method as claimed in claim 1 , wherein the intermediate transfer surface moves towards and away from the assembly plane at least twice.
8. The method as claimed in claim 1 , further comprising curing the assembly of particles into a monolithic assembly on the intermediate transfer surface.
9. The method as claimed in claim 1 , further comprising locally curing the assembly of particles on the intermediate transfer surface.
10. The method as claimed in claim 9 , further comprising transferring the assembly of particles from the intermediate transfer surface to a final substrate.
11. The method as claimed in claim 10 , further comprising globally curing the assembly of particles on a final substrate.
12. The method as claimed in claim 1 , further comprising transferring the assembly of particles from the intermediate transfer surface to a final substrate.
13. A method of performing microassembly, comprising:
forming an assembly of particles on an assembly plane;
providing an intermediate transfer surface having an array of electrodes;
applying a bias to the electrodes of the intermediate transfer surface to form an electrostatic field between the assembly plane and the intermediate transfer surface;
applying a second bias to the assembly plane to hold the assembly of particles in place;
moving the intermediate transfer surface towards the assembly surface until the electrostatic field strength is strong enough to cause transfer of the assembly of particles to the intermediate transfer surface; and
reversing the second bias to repel the particles from the assembly plane as the intermediate transfer surfaces moves towards the assembly plane.
14. The method as claimed in claim 13 , wherein the particles are uncharged on the assembly plane and the transfer occurs dielectrophoretically.
15. The method as claimed in claim 13 , wherein the intermediate transfer surface moves towards and away from the assembly plane at least twice.
16. The method as claimed in claim 13 , further comprising curing the assembly of particles into a monolithic assembly on the intermediate transfer surface.
17. The method as claimed in claim 13 , further comprising locally curing the assembly of particles on the intermediate transfer surface.