Electronic component guard ring
Guard ring technology is disclosed. In one example, an electronic component guard ring can include a barrier having a first barrier portion and a second barrier portion oriented end to end to block ion diffusion and crack propagation in an electronic component. The guard ring can also include an opening in the barrier between the first and second barrier portions extending between a first side and a second side of the barrier. Associated systems and methods are also disclosed.
1. An electronic device comprising:
an electronic component; and
a first barrier disposed about a perimeter of the electronic component and extending through layers of conductive material and layers of insulative material,
the first barrier including multiple barrier portions including gaps between adjacent barrier portions, each of the gaps between adjacent barrier portions including a bridge of material between a semiconductor material on a first side of the first barrier and a semiconductor material on a second side of the first barrier; and
a second barrier around the first barrier, the second barrier including a continuous barrier.
2. The electronic device of claim 1 , wherein:
the multiple barrier portions include at least three barrier portions.
3. The electronic device of claim 1 , wherein:
the multiple barrier portions include four barrier portions.
4. The electronic device of claim 1 , wherein the first barrier comprises a plurality of barriers spaced from one another on at least one of the first side and the second side.
5. The electronic device of claim 1 , wherein:
the second barrier comprises an outermost barrier.
6. The electronic device of claim 1 , wherein:
the first barrier comprises an innermost barrier.
7. The electronic device of claim 1 , further comprising:
a third barrier disposed about a perimeter of the electronic component.
8. The electronic device of claim 7 , wherein:
the third barrier includes multiple third barrier portions including gaps between adjacent third barrier portions.
9. The electronic device of claim 8 , wherein:
the gaps between the adjacent third barrier portions are laterally offset from the gaps between the barrier portions of the first barrier.
10. The electronic device of claim 7 , further comprising:
a fourth barrier disposed about a perimeter of the electronic component.
11. The electronic device of claim 10 , wherein:
the fourth barrier includes multiple fourth barrier portions including gaps between adjacent fourth barrier portions.
12. The electronic device of claim 1 , wherein:
the first barrier includes one or more of: tungsten, aluminum, copper, silicon, titanium, titanium nitride, ruthenium, cobalt, tantalum, and tantalum nitride.
13. The electronic device of claim 1 , wherein:
the bridge of material comprises a conductive material.
14. The electronic device of claim 1 , wherein:
the electronic component includes one or more of: a CPU (central processing unit), a GPU (graphics processing unit), a memory controller, a video decoder, an audio decoder, a video encoder, a camera processor, system memory, and a modem.
15. A system comprising:
a motherboard; and
an electronic device coupled with the motherboard, the electronic device comprising:
a first barrier disposed about a perimeter of an electronic component and extending through layers of conductive material and layers of insulative material,
the first barrier including multiple barrier portions including gaps between adjacent barrier portions, each of the gaps between adjacent barrier portions including a bridge of material between a semiconductor material on one side of the first barrier and a semiconductor material on a second side of the first barrier; and
a second barrier around the first barrier, the second barrier including a continuous barrier.
16. The system of claim 15 , wherein:
the electronic component includes one or more of: a CPU (central processing unit), a GPU (graphics processing unit), a memory controller, a video decoder, an audio decoder, a video encoder, a camera processor, a memory device, a NAND flash device, and a modem.
17. The system of claim 15 , further comprising:
one or more of: a processor, a memory device, a radio, a heat sink, and a port.
18. An electronic component guard ring comprising:
a first barrier disposed about a perimeter of an electronic component and extending through layers of conductive material and layers of insulative material,
the first barrier including multiple barrier portions including gaps between adjacent barrier portions, each of the gaps between adjacent barrier portions including a bridge of material between a semiconductor material on one side of the first barrier and a semiconductor material on a second side of the first barrier; and
a second barrier around the first barrier, the second barrier including a continuous barrier.
19. The electronic component guard ring of claim 18 , wherein:
the multiple barrier portions include at least three barrier portions.
20. The electronic component guard ring of claim 18 , wherein:
the multiple barrier portions include four barrier portions.