Semiconductor device and manufacturing method thereof
A semiconductor device and a method of manufacturing a semiconductor device. For example, various aspects of this disclosure provide a semiconductor device having an ultra-thin substrate, and a method of manufacturing a semiconductor device having an ultra-thin substrate. As a non-limiting example, a substrate structure comprising a carrier, an adhesive layer formed on the carrier, and an ultra-thin substrate formed on the adhesive layer may be received and/or formed, components may then be mounted to the ultra-thin substrate and encapsulated, and the carrier and adhesive layer may then be removed.
1. A method of manufacturing a semiconductor device, the method comprising:
receiving a substrate structure comprising:
a carrier comprising a top carrier side and a bottom carrier side;
an adhesive layer comprising a bottom adhesive layer side coupled to the top carrier side, and a top adhesive layer side; and
a panel comprising a plurality of signal distribution structures (SDSs) arranged in a multi-dimensional array, the panel comprising a bottom panel side coupled to the top adhesive layer side, and a top panel side, where each of the signal distribution structures comprises an SDS dielectric layer and an SDS conductive layer;
coupling a plurality of semiconductor dies to the top panel side, said coupling comprising coupling each semiconductor die of the plurality of semiconductor dies to a respective SDS of the plurality of SDSs, where each of the semiconductor dies comprises a bottom die side coupled to the top panel side, a top die side, and a lateral die side; and
encapsulating at least the lateral die sides of the semiconductor dies in encapsulating material,
wherein:
the plurality of signal distribution structures (SDSs) comprises a first matrix of SDSs positioned with a first lateral separation between adjacent SDSs;
the plurality of signal distribution structures (SDSs) comprises a second matrix of SDSs positioned with the first lateral separation between adjacent SDSs; and
the second matrix is positioned adjacent to the first matrix with a second lateral separation between the first matrix and the second matrix, the second lateral separation greater than the first lateral separation.
2. The method of claim 1 , wherein the bottom adhesive layer side directly contacts the top carrier side.
3. The method of claim 1 , wherein the adhesive layer laterally spans all signal distribution structures on the carrier.
4. The method of claim 1 , wherein the SDS dielectric layer comprises a single layer of a dielectric material that laterally spans all signal distribution structures on the carrier.
5. The method of claim 1 , wherein the encapsulating material comprises a rectangular top side.
6. The method of claim 1 , wherein the signal distribution structures are coreless.
7. The method of claim 1 , wherein the carrier comprises a glass carrier, and further comprising removing the carrier by, at least in part, exposing the adhesive layer to light through the glass carrier.
8. A method of manufacturing a semiconductor device, the method comprising:
receiving a substrate structure comprising:
a carrier comprising a top carrier side and a bottom carrier side;
an adhesive layer comprising a bottom adhesive layer side coupled to the top carrier side, and a top adhesive layer side; and
a panel comprising a plurality of signal distribution structures (SDSs) arranged in a multi-dimensional array, the panel comprising a bottom panel side coupled to the top adhesive layer side, and a top panel side, where each of the signal distribution structures comprises an SDS dielectric layer and an SDS conductive layer;
coupling a plurality of semiconductor dies to the top panel side, said coupling comprising coupling each semiconductor die of the plurality of semiconductor dies to a respective SDS of the plurality of SDSs, where each of the semiconductor dies comprises a bottom die side coupled to the top panel side, a top die side, and a lateral die side; and
encapsulating at least the lateral die sides of the semiconductor dies in encapsulating material,
wherein:
the plurality of semiconductor dies comprises a first matrix of semiconductor dies positioned with a first lateral separation between adjacent dies;
the plurality of semiconductor dies comprises a second matrix of semiconductor dies positioned with the first lateral separation between adjacent dies; and
the second matrix is positioned adjacent to the first matrix with a second lateral separation between the first matrix and the second matrix, the second lateral separation greater than the first lateral separation.
9. The method of claim 8 , wherein:
the panel comprises a first sub-panel and a second sub-panel, where the first sub-panel and the second sub-panel are positioned with a third lateral separation between the first sub-panel and the second sub-panel;
the first sub-panel comprises a first matrix of SDSs; and
the second sub-panel comprises a second matrix of SDSs.
10. The method of claim 9 , wherein the first sub-panel and the second sub-panel are strips.
11. The method of claim 9 , wherein the third lateral separation and the second lateral separation are substantially equal.
12. A method of manufacturing a semiconductor device, the method comprising:
receiving a substrate structure comprising:
a carrier comprising a top carrier side and a bottom carrier side;
an adhesive layer comprising a bottom adhesive layer side coupled to the top carrier side, and a top adhesive layer side; and
a panel comprising a plurality of signal distribution structures (SDSs) arranged in a multi-dimensional array, the panel comprising a bottom panel side coupled to the top adhesive layer side, and a top panel side, where each of the signal distribution structures comprises an SDS dielectric layer and an SDS conductive layer;
coupling a plurality of semiconductor dies to the top panel side, said coupling comprising coupling each semiconductor die of the plurality of semiconductor dies to a respective SDS of the plurality of SDSs, where each of the semiconductor dies comprises a bottom die side coupled to the top panel side, a top die side, and a lateral die side; and
encapsulating at least the lateral die sides of the semiconductor dies in encapsulating material,
wherein the encapsulating material comprises a first continuous portion of encapsulating material, and a second continuous portion of encapsulating material separated from the first continuous portion of encapsulating material by a gap.
13. A method of manufacturing a semiconductor device, the method comprising:
forming a structure comprising:
a carrier comprising a top carrier side and a bottom carrier side;
an adhesive layer comprising a bottom adhesive layer side coupled to the top carrier side, and a top adhesive layer side;
a signal distribution structure (SDS) matrix comprising an array of signal distribution structures coupled to each other and coupled to the top adhesive layer side, wherein the SDS matrix comprises an SDS dielectric layer and an SDS conductive layer;
a plurality of semiconductor dies coupled to the SDS matrix, where each semiconductor die of the plurality of semiconductor dies is coupled to a respective signal distribution structure of the array of signal distribution structures; and
a second plurality of semiconductor dies coupled to the SDS matrix, where each semiconductor die of the second plurality of semiconductor dies is coupled to a respective signal distribution structure of the array of signal distribution structures,
wherein
the plurality of semiconductor dies comprises a first matrix of semiconductor dies positioned with a first lateral separation between adjacent dies;
the second plurality of semiconductor dies comprises a second matrix of semiconductor dies positioned with the first lateral separation between adjacent dies; and
the second matrix is positioned adjacent to the first matrix with a second lateral separation between the first matrix and the second matrix, the second lateral separation greater than the first lateral separation;
removing the carrier and the adhesive layer from the structure; and
singulating the array of signal distribution structures.
14. The method of claim 13 , wherein:
each of the semiconductor dies comprises a top die side, a bottom die side, and a lateral die side; and
said forming the structure comprises encapsulating at least the lateral die sides in an encapsulating material.
15. The method of claim 14 , wherein the encapsulating material contacts the lateral die sides and contacts the SDS matrix.
16. The method of claim 13 , wherein the SDS dielectric layer is a single connected layer of a dielectric material that laterally spans the plurality of semiconductor dies and the second plurality of semiconductor dies.
17. The method of claim 13 , wherein the SDS matrix is a panel.
18. A method of manufacturing a semiconductor device, the method comprising:
forming a structure comprising:
a carrier comprising a top carrier side and a bottom carrier side;
an adhesive layer comprising a bottom adhesive layer side coupled to the top carrier side, and a top adhesive layer side;
a signal distribution structure (SDS) matrix comprising an array of signal distribution structures coupled to each other and coupled to the top adhesive layer side, wherein the SDS matrix comprises an SDS dielectric layer and an SDS conductive layer; and
a plurality of semiconductor dies coupled to the SDS matrix, where each semiconductor die of the plurality of semiconductor dies is coupled to a respective signal distribution structure of the array of signal distribution structures, and each semiconductor die of the plurality of semiconductor dies comprises a top die side, a bottom die side, and a lateral die side;
a second plurality of semiconductor dies coupled to the SDS matrix, where each semiconductor die of the second plurality of semiconductor dies is coupled to a respective signal distribution structure of the array of signal distribution structures, and each semiconductor die of the second plurality of semiconductor dies comprises a top die side, a bottom die side, and a lateral die side;
removing the carrier and the adhesive layer from the structure; and
singulating the array of signal distribution structures,
wherein said forming the structure comprises:
encapsulating at least the lateral die sides in an encapsulating material; and
encapsulating at least the lateral die sides of the second plurality of semiconductor dies in a second encapsulating material, where the second encapsulating material is separated from the encapsulating material.
19. The method of claim 18 , wherein the SDS dielectric layer comprises a single layer of a dielectric material that laterally spans the plurality of semiconductor dies and the second plurality of semiconductor dies.
20. The method of claim 18 , further wherein the plurality of semiconductor dies comprises a first matrix of semiconductor dies positioned with a first lateral separation between adjacent dies; the second plurality of semiconductor dies comprises a second matrix of semiconductor dies positioned with the first lateral separation between adjacent dies; and the second matrix is positioned adjacent to the first matrix with a second lateral separation between the first matrix and the second matrix, the second lateral separation greater than the first lateral separation.