IP Library Granted Patent US 10,721,836
Granted Patent B2
US 10,721,836 · App. 16/708,260 · Granted Jul 21, 2020

Electronic display with cooling

Inventors: William Dunn (Alpharetta, GA); Tim Hubbard (Alpharetta, GA)
Assignee: Manufacturing Resources International, Inc.
H05K7/202G02F1/133385H05K7/20136H05K7/20163H05K7/20972F28D9/00F28F3/02
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Quick Facts
Patent No.
US 10,721,836
App. No.
16/708,260
Granted
Jul 21, 2020
Kind
B2
Abstract

An electronic image assembly cooling system includes an enclosure having an electronic image assembly mounting space located therein. A closed loop gas circulation path and an open loop air flow path are provided to effectuate cooling. A common heat exchanger is located in gaseous communication with both the closed loop gas circulation path and the open loop air flow path. The closed loop gas circulation path encircles the electronic image assembly mounting space within the enclosure, while the open loop ambient air flow path facilitates removal of heat from gas circulating within the closed loop gas circulation path. A second open loop air flow path may pass through the enclosure and through a gap located rearward of the electronic image assembly mounting space to assist with heat removal when an electronic image assembly is mounted in the enclosure.

Claims (62)

1. A cooling system for an electronic image assembly, the cooling system comprising:

an enclosure for receiving the electronic image assembly; an electronic image assembly mounting space within the enclosure;

a transparent display surface forming a front of the enclosure, the transparent display surface located forward of and at some distance from the electronic image assembly mounting space;

an open loop air flow path passing through the enclosure rearward of the electronic image assembly mounting space;

a closed loop gas circulation path contained within the enclosure and encircling the electronic image assembly mounting space;

a common heat exchanger within the enclosure, the heat exchanger located rearward of and spaced apart from the electronic image assembly mounting space and in the pathway of both the closed loop gas circulation path and the open loop air flow path;

a gas circulation device positioned to force circulating gas around the closed loop gas circulation path and through the common heat exchanger; and

an air circulation device positioned to force ambient air through the open loop air flow path and through the common heat exchanger.

2. The cooling system of claim 1 , further comprising:

a substantially planar surface within the enclosure, the substantially planar surface located rearward of and at some distance from the electronic image assembly mounting space;

a gap defined between the electronic image assembly mounting space and the substantially planar surface;

an air inlet and an air outlet passing through the enclosure and in gaseous communication with the gap; and

the air circulation device positioned to force ambient air through the gap; wherein the gap forms a second open loop air flow path through the enclosure.

3. The cooling system of claim 2 , wherein the substantially planar surface is a plate.

4. The cooling system of claim 2 , wherein the substantially planar surface is a portion of the heat exchanger.

5. The cooling system of claim 1 , wherein a front channel of the closed loop gas circulation path resides between the transparent display surface and the electronic image assembly mounting space.

6. The cooling system of claim 5 , wherein a front portion of the electronic image assembly acts as a rear surface of the front channel when the electronic image assembly is installed in the electronic image assembly mounting space.

7. The cooling system of claim 1 , wherein the gas circulation device and the air circulation device are fan assemblies.

8. The cooling system of claim 1 , wherein the open loop air flow path and the closed loop gas circulation path pass through the heat exchanger in opposite directions.

9. The cooling system of claim 1 , wherein:

the common heat exchanger includes first and second gas pathways, the first and second gas pathways being isolated from each other;

where the first gas pathways are in gaseous communication with the open loop air flow path; and

where the second gas pathways are in gaseous communication with the closed loop gas circulation path.

10. A cooling system for an electronic image assembly, the cooling system comprising:

an enclosure for receiving the electronic image assembly;

an electronic image assembly mounting space within the enclosure;

a transparent display surface forming a front of the enclosure, the transparent display surface located forward of and at some distance from the electronic image assembly mounting space;

a closed loop gas circulation path contained within the enclosure and encircling the electronic image assembly mounting space;

a first open loop air flow path passing through the enclosure rearward of the electronic image assembly mounting space;

a common heat exchanger within the enclosure, the common heat exchanger located rearward of and spaced apart from the electronic image assembly mounting space and in the pathway of both the closed loop gas circulation path and the first open loop air flow path;

a substantially planar surface within the enclosure, the substantially planar surface located rearward of and at some distance from the electronic image assembly mounting space so as to define a gap between the electronic image assembly mounting space and the substantially planar surface;

a second open loop air flow path passing through the enclosure and through the gap;

at least one fan positioned to force circulating gas around the closed loop gas circulation path and through the common heat exchanger;

at least one fan positioned to force ambient air through the first open loop air flow path and through the common heat exchanger; and

at least one fan positioned to force ambient air through the second open loop air flow path.

11. The cooling system of claim 10 , wherein the substantially planar surface is a plate.

12. The cooling system of claim 10 , wherein the substantially planar surface is a portion of the common heat exchanger.

13. The cooling system of claim 10 , wherein a front channel of the closed loop gas circulation path resides between the transparent display surface and the electronic image assembly mounting space.

14. The cooling system of claim 13 , wherein a front portion of the electronic image assembly acts as a rear surface of the front channel when the electronic image assembly is installed in the electronic image assembly mounting space.

15. The cooling system of claim 10 , wherein:

the common heat exchanger includes first and second gas pathways, the first and second gas pathways being isolated from each other;

where the first gas pathways are in gaseous communication with the open loop air flow path; and

where the second gas pathways are in gaseous communication with the closed loop gas circulation path.

16. The cooling system of claim 10 , wherein the enclosure further includes:

a removable rear cover;

side walls; and

at least one open loop air inlet and at least one open loop air outlet.

17. A cooling system for an electronic image assembly, the cooling system comprising:

an enclosure for receiving the electronic image assembly;

an electronic image assembly mounting space within the enclosure;

a transparent display surface forming a front of the enclosure, the display surface located forward of and at some distance from the electronic image assembly mounting space;

a closed loop gas circulation path contained within the enclosure and encircling the electronic image assembly mounting space, a front channel of the closed loop gas circulation path residing between the transparent display surface and the electronic image assembly mounting space;

a first open loop air flow path passing through the enclosure rearward of the electronic image assembly mounting space;

a common heat exchanger within the enclosure, the heat exchanger located rearward of and spaced apart from the electronic image assembly mounting space and in the pathway of both the closed loop gas circulation path and the first open loop air flow path;

a plate located within the enclosure rearward of and at some distance from the electronic image assembly mounting space so as to define a gap between the electronic image assembly mounting space and the plate;

a second open loop air flow path passing through the enclosure and through the gap;

at least one fan positioned to force circulating gas around the closed loop gas circulation path and through the common heat exchanger;

at least one fan positioned to force ambient air through the first open loop air flow path and through the common heat exchanger; and

at least one fan positioned to force ambient air through the second open loop air flow path.

18. The cooling system of claim 17 , wherein the plate is a front wall of the heat exchanger.

19. The cooling system of claim 17 , wherein a front portion of the electronic image assembly acts as a rear surface of the front channel when the electronic image assembly is installed in the electronic image assembly mounting space.

20. The cooling system of claim 17 , wherein: the common heat exchanger includes first and second gas pathways, the first and second gas pathways being isolated from each other; where the first gas pathways are in gaseous communication with the open loop air flow path; and where the second gas pathways are in gaseous communication with the closed loop gas circulation path.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 10, 2019
From: DUNN, WILLIAM; HUBBARD, TIM
To: MANUFACTURING RESOURCES INTERNATIONAL, INC.
Reel/Frame 051223/0571 →
Cited By (6)
US 12,393,069 US 12,408,312 US 12,443,067 US 12,459,383 US 12,598,727 US 12,684,747