MEMS microphone
View Patent ↗A MEMS microphone, includes: a base with a back cavity; and an electric capacitance system arranged on the base. The electric capacitance system includes a back plate, a first diaphragm opposite to and arranged on one side of the back plate, and a second diaphragm arranged on the other side of the back plate. The first diaphragm and the second diaphragm keeps a distance from the back plate for forming a first insulation gap and a second insulation gap respectively. The back plate includes a plurality of through holes; the first diaphragm and the second diaphragm are circular. The MEMS microphone further includes a first support piece between the first diaphragm and the second diaphragm through the through holes. Thus, the two diaphragms are not easy to adhere to the back plate.
1. A MEMS microphone, including:
a base with a back cavity;
an electric capacitance system arranged on the base, the electric capacitance system including a back plate, a first diaphragm opposite to and arranged on one side of the back plate, and a second diaphragm arranged on the other side of the back plate; the first diaphragm and the second diaphragm being keeping a distance from the back plate for forming a first insulation gap and a second insulation gap respectively; wherein
the back plate includes a plurality of through holes; the first diaphragm and the second diaphragm are circular;
the MEMS microphone further includes a first support piece arranged between the first diaphragm and the second diaphragm through the through holes, one end of the first support piece is connected to the center of the first diaphragm, and the other end is connected to the circle center of the second diaphragm.
2. The MEMS microphone in claim 1 further comprising at least two second supports arranged between the first diaphragm and the second diaphragm through the through holes, wherein the at least two second supports are uniformly arranged on the circumference with the first support as the circle center.
3. The MEMS microphone in claim 2 , wherein the first supporting component and/or the second supporting component are cylindrical structures.
4. The MEMS microphone in claim 3 , wherein the first supporting component and/or the second supporting component are cylindrical structures; the first supporting component and/or the second supporting component do not contact the backplane.
5. The MEMS microphone in claim 1 , wherein the upper and lower surfaces of the backplane includes a number of bumps for preventing the first diaphragm and the second diaphragm from adhering to the backplane.
6. The MEMS microphone in claim 1 , further comprising an insulating layer arranged on the surface of the base, and the electric capacitance system is connected with the base through the insulating layer.
7. The MEMS microphone in claim 6 , wherein the back cavity penetrates the base and the insulating layer.