Method of manufacturing element array and method of removing specific element
In a method of manufacturing an element array, prepared is an adhesive sheet in which elements are arranged in a predetermined array on an adhesive layer. A specific element among the arrayed elements is removed from the adhesive sheet by radiating a laser to the specific element. The arrayed elements are directly or indirectly transferred onto a mounting substrate.
1. A method of manufacturing an element array, comprising the steps of:
preparing an adhesive sheet in which elements are arranged in a predetermined array on an adhesive layer;
removing a specific element among the arrayed elements from the adhesive sheet by directly radiating a laser on a surface of the specific element; and
directly or indirectly transferring the arrayed elements onto a mounting substrate.
2. The method according to claim 1 , further comprising a step of attaching a good element different from the specific element onto the adhesive layer of the adhesive sheet at a vacant position from which the specific element is removed.
3. The method according to claim 1 , further comprising the steps of:
forming the elements in a predetermined array on an element-formation substrate; and
transferring the arrayed elements formed on the element-formation substrate onto the adhesive layer of the adhesive sheet.
4. The method according to claim 3 , further comprising a step of inspecting each of the elements formed in the predetermined array on the element-formation substrate.
5. The method according to claim 1 , further comprising a step of inspecting each of the elements formed in the predetermined array on the adhesive layer of the adhesive sheet.
6. The method according to claim 1 , wherein the elements are display elements.
7. The method according to claim 1 , wherein the specific element is radiated by the laser in a radiation area having a rectangular spot shape fitted to a plane shape of the specific element.
8. The method according to claim 1 , wherein the specific element is radiated by the laser in an area including an entire plane shape of the specific element.
9. The method according to claim 1 , wherein the laser has an output power and a wavelength determined so that the specific element is flipped away from the adhesive sheet by the laser radiation with three or less applications of the laser radiation.
10. The method according to claim 9 , wherein the laser has a wavelength of 532 nm or less.
11. The method according to claim 1 , wherein the surface is an exposed surface.
12. A method of removing a specific element, comprising the steps of:
preparing an adhesive sheet in which elements are arranged in a predetermined array on an adhesive layer; and
directly radiating a laser on a surface of a specific element among the elements arranged in the predetermined array so as to remove the specific element from the adhesive sheet and to leave the other elements on the adhesive sheet.
13. The method according to claim 12 , wherein the specific element is radiated by the laser in a radiation area having a rectangular spot shape fitted to a plane shape of the specific element.
14. The method according to claim 12 , wherein the specific element is radiated by the laser in an area including an entire plane shape of the specific element.
15. The method according to claim 12 , wherein the laser has an output power and a wavelength determined so that the specific element is flipped away from the adhesive sheet by the laser radiation with three or less applications of the laser radiation.
16. The method according to claim 15 , wherein the laser has a wavelength of 532 nm or less.
17. The method according to claim 12 , wherein the surface is an exposed surface.