Acoustic wave device, high frequency front end circuit, and communication apparatus

1. An acoustic wave device comprising:

a supporting substrate;

an acoustic reflection layer directly or indirectly on the supporting substrate;

a piezoelectric layer directly or indirectly on the acoustic reflection layer;

one or more IDT electrodes directly or indirectly on the piezoelectric layer; and

a wiring electrode directly or indirectly on the piezoelectric layer and electrically connected to the one or more IDT electrodes; wherein

the acoustic reflection layer includes:

a first dielectric layer;

a second dielectric layer closer to the supporting substrate than the first dielectric is to the supporting substrate and having an acoustic impedance higher than that of the first dielectric layer; and

a metal layer closer to the piezoelectric layer than the first dielectric layer is to the piezoelectric layer and having an acoustic impedance higher than that of the first dielectric layer; and

when the acoustic reflection layer is viewed in plan, in a region that encompasses one of the one or more IDT electrodes and a wiring electrode connected to the one IDT electrode but does not encompass any IDT electrodes other than the one of the one or more IDT electrodes, an area in which the metal layer is provided is smaller than an area in which the second dielectric layer is provided.

2. The acoustic wave device according to claim 1 , wherein

each of the one or more IDT electrodes includes a pair of comb-shaped electrodes; and

a film thickness of the piezoelectric layer is less than or equal to an IDT wavelength, which is defined by a pitch of a plurality of electrode fingers of one of the pair of comb-shaped electrodes.

3. The acoustic wave device according to claim 1 , wherein the acoustic reflection layer further includes a third dielectric layer between the metal layer and the piezoelectric layer and has an acoustic impedance lower than that of the metal layer.

4. The acoustic wave device according to claim 3 , wherein a film thickness of the third dielectric layer and a film thickness of the first dielectric layer are different.

5. The acoustic wave device according to claim 1 , wherein the acoustic reflection layer includes:

at least one of a plurality of the metal layers provided in a perpendicular or substantially perpendicular direction of the piezoelectric layer and a plurality of the second dielectric layers laminated in the perpendicular or substantially perpendicular direction;

a fourth dielectric layer having an acoustic impedance lower than that of the plurality of metal layers and being respectively provided between the plurality of metal layers; and

a fifth dielectric layer having an acoustic impedance lower than that of the plurality of second dielectric layers and being respectively provided between the plurality of second dielectric layers.

6. The acoustic wave device according to claim 5 , wherein a film thickness of the fourth dielectric layer and a film thickness of the fifth dielectric layer are different.

7. The acoustic wave device according to claim 1 , wherein the metal layer is made of Pt or W.

8. The acoustic wave device according to claim 1 , wherein the first dielectric layer is made of silicon oxide.

9. The acoustic wave device according to claim 1 , wherein the second dielectric layer is made of Ta 2 O 5 .

10. The acoustic wave device according to claim 1 , wherein, when the acoustic reflection layer is viewed in plan, the metal layer is in a region that encompasses the one of the one or more IDT electrodes but does not encompass the wiring electrode.

11. A high frequency front end circuit comprising:

the acoustic wave device according to claim 1 ; and

an amplifying circuit connected to the acoustic wave device.

12. The high frequency front end circuit according to claim 11 , wherein

each of the one or more IDT electrodes includes a pair of comb-shaped electrodes; and

a film thickness of the piezoelectric layer is less than or equal to an IDT wavelength, which is defined by a pitch of a plurality of electrode fingers of one of the pair of comb-shaped electrodes.

13. The high frequency front end circuit according to claim 11 , wherein the acoustic reflection layer further includes a third dielectric layer between the metal layer and the piezoelectric layer and has an acoustic impedance lower than that of the metal layer.

14. The high frequency front end circuit according to claim 13 , wherein a film thickness of the third dielectric layer and a film thickness of the first dielectric layer are different.

15. The high frequency front end circuit according to claim 11 , wherein

the acoustic reflection layer includes:

at least one of a plurality of the metal layers provided in a perpendicular or substantially perpendicular direction of the piezoelectric layer and a plurality of the second dielectric layers laminated in the perpendicular or substantially perpendicular direction;

a fourth dielectric layer having an acoustic impedance lower than that of the plurality of metal layers and being respectively provided between the plurality of metal layers; and

a fifth dielectric layer having an acoustic impedance lower than that of the plurality of second dielectric layers and being respectively provided between the plurality of second dielectric layers.

16. The high frequency front end circuit according to claim 15 , wherein a film thickness of the fourth dielectric layer and a film thickness of the fifth dielectric layer are different.

17. The high frequency front end circuit according to claim 11 , wherein the metal layer is made of Pt or W.

18. The high frequency front end circuit according to claim 11 , wherein the first dielectric layer is made of silicon oxide.

19. The high frequency front end circuit according to claim 11 , wherein the second dielectric layer is made of Ta 2 O 5 .

20. A communication apparatus comprising:

the high frequency front end circuit according to claim 11 ; and

a signal processing circuit that processes a high frequency signal.