Vertical-cavity surface-emitting laser
A vertical-cavity surface-emitting laser (VCSEL) including a lower mirror, an upper mirror having an insulation region including implanted ions and an isolation region surrounded by the insulation region, an active layer interposed between the lower mirror and the upper mirror, an aperture forming layer interposed between the upper mirror and the active layer, and including an oxidation layer and a window layer surrounded by the oxidation layer, and a plurality of oxidation holes disposed in the isolation region and passing through the upper mirror and the aperture forming layer.
1. A vertical-cavity surface-emitting laser (VCSEL), comprising:
a lower mirror;
an upper mirror having an insulation region including implanted ions and an isolation region surrounded by the insulation region;
an active layer interposed between the lower mirror and the upper mirror;
an aperture forming layer interposed between the upper mirror and the active layer, and including an oxidation layer and a window layer disposed in the isolation region and surrounded by the oxidation layer;
a connector disposed on the upper mirror;
a plurality of oxidation holes disposed in the isolation region and passing through the upper mirror and the aperture forming layer; and
an upper insulation layer covering the plurality of oxidation holes,
wherein at least a portion of the connector is disposed in the oxidation holes.
2. The VCSEL of claim 1 , wherein the insulation region extends from the upper mirror to a portion of the lower mirror.
3. The VCSEL of claim 1 , further comprising an ohmic contact layer disposed on the upper mirror,
wherein the ohmic contact layer includes a circular portion and protrusions protruding outwardly from the circular portion.
4. The VCSEL of claim 3 , wherein the circular portion has a partially incised ring-shape.
5. The VCSEL of claim 4 , wherein the oxidation holes are disposed between the protrusions.
6. The VCSEL of claim 5 , wherein the oxidation holes have smaller widths than those of the protrusions, respectively.
7. The VCSEL of claim 4 , further comprising:
a surface protection layer covering the ohmic contact layer and the upper mirror; and
the upper insulation layer disposed on the surface protection layer,
wherein the oxidation holes pass through the surface protection layer.
8. The VCSEL of claim 7 , further comprising a plurality of via holes passing through the upper insulation layer and the surface protection layer and exposing the ohmic contact layer,
wherein the via holes are disposed to correspond to the protrusions.
9. The VCSEL of claim 8 , further comprising a pad, wherein:
the pad is disposed in the insulation region; and
the connector extends from the pad and electrically connects the pad and the ohmic contact layer through the via holes.
10. The VCSEL of claim 1 , wherein the oxidation holes have substantially a circular or a quadrangular shape.
11. A vertical-cavity surface-emitting laser (VCSEL) comprising:
a lower mirror;
an upper mirror having an insulation region including implanted ions and an isolation region surrounded by the insulation region;
an emitter array including a plurality of emitters disposed in the isolation region;
an active layer interposed between the lower mirror and the upper mirror;
an aperture forming layer interposed between the upper mirror and the active layer, and including an oxidation layer and a window layer surrounded by the oxidation layer;
a connector disposed on the upper mirror;
a plurality of oxidation holes disposed in the isolation region and passing through the upper mirror and the aperture forming layer, each oxidation hole being disposed to correspond to each emitter of the emitter array; and
an upper insulation layer covering the plurality of oxidation holes,
wherein at least a portion of the connector is disposed in the oxidation holes.
12. The VCSEL of claim 11 , wherein the insulation region extends from the upper mirror to a portion of the lower mirror.
13. The VCSEL of claim 11 , further comprising ohmic contact layers disposed on the upper mirror to correspond to each emitter of the emitter array, respectively, wherein:
each ohmic contact layer has a circular portion and protrusions protruding outwardly from the circular portion; and
the oxidation holes are disposed between the protrusions.
14. The VCSEL of claim 13 , wherein the circular portion has a partially incised ring-shape.
15. The VCSEL of claim 13 , wherein the oxidation holes have smaller widths than those of the protrusions, respectively.
16. The VCSEL of claim 13 , further comprising:
a surface protection layer covering the ohmic contact layer and the upper mirror; and
the upper insulation layer disposed on the surface protection layer,
wherein the oxidation holes pass through the surface protection layer.
17. The VCSEL of claim 16 , further comprising a plurality of via holes passing through the upper insulation layer and the surface protection layer and exposing the ohmic contact layer,
wherein the via holes are disposed to correspond to the protrusions.
18. The VCSEL of claim 17 , further comprising a pad, wherein:
the pad is disposed in the insulation region; and
the connector extends from the pad and electrically connects the pad and the ohmic contact layer through the via holes.
19. The VCSEL of claim 18 , wherein the connector has a mesh shape including circular openings corresponding to each emitter.
20. The VCSEL of claim 11 , wherein the oxidation holes have substantially a circular or a quadrangular shape.