Setting up ultra-small or ultra-thin discrete components for easy assembly
Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.
1. An apparatus comprising:
a first substrate;
a release layer attached to the first substrate; and
a discrete component attached to the release layer,
in which the release layer is configured to undergo a change in state at least partially concurrently with a change in state of an adhesive layer attached to a device substrate, in which the change in state of the release layer is a change to a state in which the release layer has an adhesion that is not sufficient to adhere the discrete component to the first substrate, and in which the change in state of the adhesive layer is a change to a state in which the adhesive layer has an adhesion that is sufficient to adhere the discrete component to the device substrate.
2. The apparatus of claim 1 , in which the discrete component has an ultra-thin, an ultra-small, or an ultra-thin and ultra-small configuration.
3. The apparatus of claim 1 , in which at least one side of the first substrate has a length longer than at least one side of the discrete component.
4. The apparatus of claim 1 , in which the release layer comprises multiple layers, wherein a first layer of the multiple layers is permanent adhesive and a second layer of the multiple layers is one or more of thermally sensitive and UV sensitive.
5. The apparatus of claim 1 , in which the release layer and the adhesive layer are configured such that the change in state of the release layer and the change in state of the adhesive layer are caused by a common stimulus.
6. The apparatus of claim 5 , in which the common stimulus comprises UV light.
7. The apparatus of claim 5 , in which the common stimulus comprises thermal energy.
8. The apparatus of claim 1 , in which the discrete component comprises an integrated circuit on a face of the discrete component in contact with the release layer.
9. The apparatus of claim 1 , in which the change in state of the adhesive layer comprises a curing of the release layer.
10. An apparatus comprising:
a substrate;
a release layer attached to the substrate, the release layer comprising multiple layers, wherein a first layer of the multiple layers is permanent adhesive and a second layer of the multiple layers is one or more of thermally sensitive and UV light sensitive; and
a discrete component releasably attached to the substrate by the release layer, the discrete component having an ultra-thin, an ultra-small, or an ultra-thin and ultra-small configuration, at least one side of the substrate having a length longer than at least one side of the discrete component, wherein the release layer is configured to release the discrete component from the release layer in response to a stimulus applied to the release layer, such that, subsequent to being released from the release layer, the discrete component is in contact with neither the first layer nor the second layer.
11. The apparatus of claim 10 , in which the first layer of the release layer is attached to the substrate, and in which the discrete component is releasably attached to the second layer of the release layer.
12. The apparatus of claim 10 , in which the discrete component has a thickness less than about 50 microns.
13. The apparatus of claim 10 , in which the release layer is configured to releasably attach the discrete component to the substrate as the discrete component comes into contact with the substrate.
14. The apparatus of claim 10 , in which the substrate has a thickness of at least 50 microns and at least one side length of at least 300 microns.
15. The apparatus of claim 10 in which the discrete component comprises an integrated circuit on a face of the discrete component facing away from the release layer.
16. The apparatus of claim 10 , in which the discrete component comprises an integrated circuit on a face of the discrete component in contact with the release layer.
17. The apparatus of claim 10 , in which the release layer is configured to release the discrete component from the release layer by melting.
18. The apparatus of claim 10 , in which the release layer is configured to release the discrete component in response to application of a normal or shear force to the discrete component.
19. The apparatus of claim 10 , in which the second layer of the release layer has a thermal sensitivity that is configured to cause a decrease in an adhesive strength of the second layer of the release layer in response to an application of thermal energy to the release layer.
20. The apparatus of claim 10 , in which the second layer of the release layer has a UV light sensitivity that is configured to cause a decrease in an adhesive strength of the second layer of the release layer in response to an application of UV light to the release layer.