IP Library › Granted Patent US 11,043,279
Granted Patent B2
US 11,043,279 · App. 16/729,838 · Granted Jun 22, 2021

Method for reading three-dimensional flash memory

Inventors: Zilong Chen (Hubei, CN); Xiang Fu (Hubei, CN)
Assignee: Yangtze Memory Technologies Co., Ltd.
G11C16/3427G11C16/0483G11C16/08G11C16/26H01L27/11582
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Quick Facts
Patent No.
US 11,043,279
App. No.
16/729,838
Granted
Jun 22, 2021
Kind
B2
Abstract

A method for conducting a read-verification operation on a target memory cell in a three-dimensional (3D) memory device includes removing fast charges of the target memory cell at a read-prepare step and measuring a threshold voltage of the target memory cell at a sensing step. Removing the fast charges of the target memory cell includes applying a prepare voltage (V prepare ) on an unselected top select gate (Unsel_TSG) of an unselected memory string, applying a first off voltage (V off ) on a selected word line (Sel_WL) associated with the target memory cell, and applying a pass voltage (V pass ) on an unselected word line (Unsel_WL).

Claims (31)

1. A method for conducting a read-verification operation on a target memory cell in a three-dimensional (3D) memory device, comprising:

removing fast charges of the target memory cell at a read-prepare step, comprising:

applying a prepare voltage (V prepare ) on an unselected top select gate (Unsel_TSG) of an unselected memory string;

applying a first off voltage (V off ) on a selected word line (Sel_WL) associated with the target memory cell; and

applying a pass voltage (V pass ) on an unselected word line (Unsel_WL); and

measuring a threshold voltage of the target memory cell at a sensing step.

2. The method of claim 1 , further comprising:

applying a top select gate voltage (V tsg ) on a selected top select gate (Sel_TSG) of a selected memory string containing the target memory cell; and

applying a lower select gate voltage (V lsg ) on a lower select gate (LSG) of the selected memory string containing the target memory cell.

3. The method of claim 2 , wherein applying the top select gate voltage (V tsg ) comprises electrically connecting the selected memory string to a bit line; and applying the lower select gate voltage (V lsg ) comprises electrically connecting the selected memory string to an array common source.

4. The method of claim 2 , wherein applying the top select gate voltage (V tsg ) comprises applying a voltage between 4V to 7V.

5. The method of claim 2 , wherein applying the lower select gate voltage (V lsg ) comprises applying a voltage between 4V to 7V.

6. The method of claim 2 , wherein applying the pass voltage (V pass ) comprises applying the pass voltage with a delay period after the selected top select gate (Sel_TSG) and the lower select gate (LSG) are at the top select gate voltage (V tsg ) and the lower select gate voltage (V lsg ), respectively.

7. The method of claim 1 , wherein measuring the threshold voltage comprises applying a read voltage (V read ) on the selected word line (Sel_WL).

8. The method of claim 7 , wherein applying the read voltage (V read ) comprises applying a voltage between 0 to 2V.

9. The method of claim 7 , wherein applying the read voltage (V read ) comprises applying a second off voltage on the unselected word line (Unsel_WL).

10. The method of claim 9 , wherein applying the second off voltage on the unselected word line (Unsel_WL) comprises applying a 0V.

11. The method of claim 7 , wherein applying the read voltage (V read ) comprises applying the read voltage (V read ) when a voltage of the unselected top select gate (Unsel_TSG) is higher than a threshold voltage of an unselected memory cell.

12. The method of claim 7 , wherein applying the read voltage (V read ) comprises applying the read voltage (V read ) when a voltage of the unselected top select gate (Unsel_TSG) equals to a threshold voltage of an unselected memory cell.

13. The method of claim 7 , wherein applying the read voltage (V read ) comprises applying the read voltage (V read ) when a voltage of the unselected top select gate (Unsel_TSG) is lower than a threshold voltage of an unselected memory cell.

14. The method of claim 1 , wherein applying the prepare voltage (V prepare ) comprises applying a voltage between 4V to 7V.

15. The method of claim 1 , wherein applying the first off voltage (V off ) comprises applying a 0V.

16. The method of claim 1 , wherein applying the pass voltage (V pass ) comprises applying a voltage between 5V to 9V.

17. The method of claim 1 , wherein removing the fast charges comprises removing the fast charges from a storage layer of the target memory cell of a selected memory string, wherein the selected memory string comprises:

a channel hole penetrating vertically through a film stack of alternating conductive and dielectric layers;

a core filling film in a center of the channel hole;

a memory film covering a sidewall of the channel hole, wherein the memory film comprises a barrier layer, the storage layer and a tunneling layer; and

a channel layer sandwiched between the memory film and the core filling film.

18. The method of claim 17 , wherein removing the fast charges comprises removing electrical charges from shallow traps in the storage layer of the target memory cell.

19. The method of claim 17 , wherein removing the fast charges comprises removing the fast charges from the target memory cell to a neighboring unselected memory cell.

20. The method of claim 1 , wherein conducting the read-verification operation comprises conducting the read-prepare step and conducting a failed bit count in parallel.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2020
From: CHEN, ZILONG; FU, XIANG
To: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
Reel/Frame 052299/0729 →
Continuity (2)
Continuation PCTCN2019112728 · Oct 23, 2019
Related Publication 20210125674A1 · Apr 29, 2021
Cited By (1)
US 12,272,410