Chip antenna
A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.
1. A chip antenna comprising:
a first ceramic substrate comprising a first surface;
a second ceramic substrate comprising a second surface disposed to face the first surface of the first ceramic substrate, the second ceramic substrate being spaced apart from the first ceramic substrate such that air is disposed between the first surface of the first ceramic substrate and the second surface of the second ceramic substrate;
a first patch disposed in a first groove on the first surface of the first ceramic substrate and configured to operate as a feed patch; and
a second patch disposed in a second groove on the second surface of the second ceramic substrate and configured to operate as a radiation patch.
2. The chip antenna of claim 1 , wherein the first patch has a first thickness greater than a depth of the first groove and the second patch has a second thickness greater than a depth of the second groove.
3. The chip antenna of claim 1 , wherein the first patch is disposed in an entire area formed by the first groove and the second patch is disposed in an entire area formed by the second groove.
4. The chip antenna of claim 1 , further comprising a third patch disposed in a third grove on a third surface of the second ceramic substrate opposite the second surface of the second ceramic substrate.
5. The chip antenna of claim 1 , further comprising a spacer disposed between the first ceramic substrate and the second ceramic substrate.
6. The chip antenna of claim 1 , further comprising a bonding layer disposed between the first ceramic substrate and the second ceramic substrate.
7. A chip antenna comprising:
a first ceramic substrate comprising a first surface;
a second ceramic substrate comprising a second surface disposed to face the first surface of the first ceramic substrate, the second ceramic substrate being spaced apart from the first ceramic substrate such that air is disposed between the first surface of the first ceramic substrate and the second surface of the second ceramic substrate;
a first patch disposed on the first ceramic substrate and to which a feed signal is applied; and
a second patch disposed on the second ceramic substrate and coupled to the first patch,
wherein the first surface of the first ceramic substrate comprises a first groove that forms a first step in a thickness direction, and
wherein the second surface of the second ceramic substrate comprises a second groove that forms a second step in a thickness direction, and
the first patch is disposed in the first groove to completely fill the first step and the second patch is disposed in the second groove to completely fill the second step.
8. The chip antenna of claim 7 , wherein a thickness of the second patch is equal to a depth of the second groove.
9. The chip antenna of claim 7 , wherein the second patch is disposed in an entire area formed by the second groove.
10. The chip antenna of claim 7 , further comprising a spacer disposed between the first ceramic substrate and the second ceramic substrate.
11. The chip antenna of claim 7 , further comprising a bonding layer disposed between the first ceramic substrate and the second ceramic substrate.
12. A chip antenna comprising:
a first ceramic substrate comprising a first groove disposed along a first surface thereof;
a second ceramic substrate spaced apart from the first ceramic substrate and comprising a second groove disposed along a second surface that opposes the first surface of the first ceramic substrate;
a feed patch disposed in the first groove; and
a radiation patch coupled to the feed patch and disposed in the second groove, wherein
the feed patch extends beyond the first surface of the first ceramic substrate and/or the radiation patch extends beyond the first surface of the second ceramic substrate.