PCM cell with resistance drift correction
Phase change memory devices and methods of forming the same include forming a fin structure from a first material. A phase change memory cell is formed around the fin structure, using a phase change material that includes two solid state phases at an operational temperature.
1. A method for forming a phase-change memory device, comprising:
forming a fin structure from a first material; and
forming a phase change memory cell, around the fin structure and along an entire height of sidewalls of the fin structure, from a phase change material that includes two solid state phases at an operational temperature, comprising:
depositing phase change material over the fin structure; and
polishing the phase change material down to a same height as a top surface of the fin structure.
2. The method of claim 1 , further comprising forming a heater before forming the fin structure, wherein the fin structure is formed on the heater.
3. The method of claim 1 , wherein the first material has a resistivity at the operational temperature that is between a resistivity of a first phase of the phase change material at the operational temperature and a resistivity of a second phase of the phase change material at the operational temperature.
4. The method of claim 3 , wherein the first material is titanium nitride and the phase change material is a germanium-antimony-tellurium alloy.
5. The method of claim 1 , further comprising etching the fin structure and the phase change memory cell to form a pillar.
6. The method of claim 1 , further comprising forming a top electrode over the phase change memory cell and the fin structure.
7. The method of claim 6 , wherein forming the top electrode is performed before the phase change memory cell is formed, using the top electrode as a mask to etch the phase change memory cell.
8. The method of claim 6 , wherein forming the phase change memory cell is performed before top electrode is formed.
9. A method for forming a phase-change memory device, comprising:
forming a bottom electrode on a substrate;
forming a heater layer on the bottom electrode;
forming a fin structure from a first material on the heater layer;
forming spacers on sidewalls of the fin structure;
etching into the heater layer, around the spacers, to form a heater under the fin structure;
forming a phase change memory cell, sandwiching the fin structure along an entire height of sidewalls of the fin structure, from a phase change material that includes two solid state phases at an operational temperature, comprising:
depositing the phase change material over the fin structure; and
polishing the phase change material down to a same height as a top surface of the fin structure; and
forming a top electrode on the phase change memory cell and the fin structure, wherein the phase change memory cell extends from the bottom of the top electrode to the top of the heater.
10. The method of claim 9 , wherein the first material has a resistivity at the operational temperature that is between a resistivity of a first phase of the phase change material at the operational temperature and a resistivity of a second phase of the phase change material at the operational temperature.
11. The method of claim 10 , wherein the first material is titanium nitride and the phase change material is a germanium-antimony-tellurium alloy.
12. The method of claim 9 , further comprising etching the fin structure, the phase change memory cell, and the heater to form a pillar.
13. The method of claim 9 , wherein forming the top electrode is performed before the phase change memory cell is formed, using the top electrode as a mask to etch the phase change memory cell.
14. The method of claim 9 , wherein forming the phase change memory cell is performed before top electrode is formed.