Electronic component
In an exemplary embodiment, an electronic component includes: an element body part 10 constituted by an insulative body of rectangular solid shape; an internal conductor 30 provided inside the element body part 10 ; and external electrodes 50 provided at least on the bottom face 14 (mounting surface) of the element body part 10 and electrically connected to the internal conductor 30 ; wherein the element body part 10 has: a conductor-containing layer 20 in which a coil conductor 36 (functional part) that will become a part of the internal conductor 30 to demonstrate electrical performance, is provided; and a high-hardness layer 22 which is provided side by side with the conductor-containing layer 20 in a direction parallel with the bottom face 14 (mounting surface) of the element body part 10 , and which has a higher hardness compared to the conductor-containing layer 20 . The electronic component has improve mechanical strength.
1. An electronic component, comprising:
an element body part constituted by an insulative body of rectangular solid shape having six faces;
an internal conductor embedded inside the element body part; and
external electrodes electrically connected to the internal conductor;
wherein the element body part has:
among the six faces, at least one mountable face which is defined as any face on which the external electrodes are provided, wherein each mountable face constitutes a mounting surface of the element body part;
a conductor-containing layer having a first hardness, in which a functional part, or part demonstrating electrical performance, of the internal conductor is embedded; and
a high-hardness layer having a second hardness which is higher than the first hardness, wherein independently of which mountable face constitutes the mounting surface, the high-hardness layer is disposed on a lateral side of the conductor-containing layer,
wherein a marker part indicative of which face is the mounting surface is planar and extends on a face of the high-hardness layer, other than the mounting surface, wherein the face of the high-hardness layer is an outer face adjoining the mounting surface on a lateral side of the high-hardness layer which is parallel to the lateral side of the conductor-containing layer, said marker part containing a pigment different in color from the high-hardness layer,
wherein the marker part on the face of the high-hardness layer has a shape longer in a direction perpendicular to the mounting surface than in a direction parallel to the mounting surface.
2. An electronic component according to claim 1 , wherein the high-hardness layer contains, by a higher percentage than the conductor-containing layer does, a filler made of at least metal oxide or silicon oxide.
3. An electronic component according to claim 1 , wherein the element body part has the high-hardness layer in multiple areas, wherein the multiple high-hardness layers are provided in a manner sandwiching the conductor-containing layer.
4. An electronic component according to claim 1 , wherein the conductor-containing layer is thicker than the high-hardness layer in a direction in which the conductor-containing layer and high-hardness layer are provided side by side.
5. An electronic component according to claim 1 , wherein the internal conductor has a coil conductor as the functional part.
6. An electronic component according to claim 5 , wherein the coil conductor is provided only in the conductor-containing layer, among the conductor-containing layer and the high-hardness layer.
7. An electronic component according to claim 5 wherein the conductor-containing layer has a dielectric constant lower than that of the high-hardness layer.
8. An electronic component according to claim 7 , wherein the conductor-containing layer and high-hardness layer are each constituted by a material containing glass or resin, and a content by percentage of a silicon component in a material constituting the conductor-containing layer is higher than a content by percentage of a silicon component in a material constituting the high-hardness layer.
9. An electronic component according to claim 5 , wherein the coil conductor has a coil axis running roughly in parallel with the mounting surface.
10. An electronic component according to claim 1 , wherein the functional part is electrically connected to the external electrodes, via lead conductors, at the mounting surface, or at the end faces adjoining the mounting surface, of the element body part.
11. An electronic component according to claim 1 , wherein a dimension, H, of the end faces measured in a direction perpendicular to the mounting surface, and a dimension, W, of the end faces measured in a direction parallel with the mounting surface, satisfies a relationship of H>W.
12. An electronic component according to claim 1 , wherein the marker part has a higher hardness compared to the conductor-containing layer.
13. An electronic component according to claim 1 , wherein
the external electrodes consist of a pair of external electrodes, and
the element body part has a second high-hardness layer having a second hardness which is higher than the first hardness, wherein independently of which mountable face constitutes the mounting surface, the high-hardness layer is disposed on a second lateral side of the conductor-containing layer opposite to the lateral side of the conductor-containing layer in a manner sandwiching the conductor-containing layer,
wherein a second marker part indicative of which face is the mounting surface is planar and extends on a face of the second high-hardness layer, other than the mounting surface, wherein the face of the second high-hardness layer is an outer face adjoining the mounting surface on a lateral side of the second high-hardness layer which is parallel to the second lateral side of the conductor-containing layer, said second marker part containing a pigment different in color from the high-hardness layer.