Line structure and a method for producing the same
A multi-layer line structure including a substrate, a lower layer Cu line located on the substrate, an upper layer Cu line located on an insulating layer including an inorganic film located on the lower layer Cu line and an organic resin film located on the inorganic film, and a via connection part located in a via connection hole running in an up-down direction through the insulating layer in an area where the lower layer Cu line and the upper layer Cu line overlap each other is provided. The via connection part includes a barrier conductive layer located on a part of the lower layer Cu line exposed to a bottom part of the via connection hole and on an inner wall of the via connection hole.
1. A multi-layer line structure comprising:
a first line layer;
a second line layer located on a first organic resin film located on the first line layer;
a first insulating layer including an inorganic layer located on the second line layer and a second organic resin film located on the inorganic layer, the inorganic layer being insulating a third line layer located under the first line layer;
a third organic resin film located between the third line layer and the first line layer; and
a first via connection part located in a first via connection hole running in an up-down direction through the first organic resin film in an area where the first line layer and the second line layer overlap each other,
wherein:
the inorganic layer wholly covers and is in contact with a side surface of the second line layer and at least the part of the top surface of the second line layers;
the first organic resin film wholly covers and is in contact with a side surface of the first line layer and at least the part of the top surface of the first line layer; and
the third organic resin film wholly covers and is in contact with a side surface of the third line layer and at least the part of the top surface of the third line layer.
2. A multi-layer line structure comprising:
a first line layer;
a second line layer located above a first line layer;
a first insulating layer located between the first line layer and the second line layer, the first insulating layer including an inorganic layer located on the first line layer and a first organic resin film located on the inorganic layer, the inorganic layer being insulating;
a second organic resin film located on the second line layer,
a third line layer located under the first line layer;
a third organic resin film located between the third line layer and the first line layer; and
a first via connection part located in a first via connection hole running in an up-down direction through the first insulating layer in an area where the first line layer and the second line layer overlap each other,
wherein:
the inorganic layer wholly covers and is in contact with a side surface of the first line layer and at least the part of the top surface of the first line layer;
the second organic resin film wholly covers and is in contact with a side surface of the second line layer and at least the part of the top surface of the second line layer; and
the third organic resin film wholly covers and is in contact with a side surface of the third line layer and at least the part of the top surface of the third line layer.