Direct bonded heterogeneous integration packaging structures
Direct bonding heterogeneous integration packaging structures and processes include a packaging substrate with first and second opposing surfaces. A trench or a pedestal is provided in the first surface. A bridge is disposed in the trench or is adjacent the pedestal sidewall, wherein the bridge includes an upper surface coplanar with the first surface of the package substrate. At least two chips in a side by side proximal arrangement overly the bridge and the packaging substrate, wherein the bridge underlies peripheral edges of the at least two chips in the side by side proximal arrangement. The at least two chips include a plurality of electric connections that are directly coupled to corresponding electrical connections on the bridge and on the packaging substrate.
1. A process for forming an integrated circuit packaging structure comprising:
providing a packaging substrate comprising a first surface and a pedestal, wherein the pedestal comprises a second surface that is raised with respect to the first surface;
providing a bridge directly on the first surface of the substrate and adjacent to a sidewall of the pedestal, wherein the bridge comprises a memory chip;
providing a first chip over the pedestal, wherein the first chip is electrically coupled to the second surface of the pedestal using first connections having a first height, and wherein the first chip is electrically coupled to a topmost surface of the bridge using second connections having a second height different than the first height;
providing a second chip over the bridge, wherein the second chip is electrically coupled to the topmost surface of the bridge using third connections having a third height different than the first height and different than the second height, wherein the bridge underlies peripheral edges of the second chip and supports the second chip by the corresponding third connections; and
providing a lid over the bridge, the first chip, the second chip, and the pedestal, wherein the lid is coupled to the first surface using a lid adherent adhesive.
2. The process of claim 1 , further comprising affixing the second chip in an assembly fixture or a or temporary carrier prior to directly coupling the second chip to the bridge; placing the fixture including the second chip and the bridge on the packaging substrate; and subjecting the integrated circuit to thermocompression bonding or furnace reflow.
3. The process of claim 1 , wherein the packaging substrate comprises an organic laminate.
4. The process of claim 1 further comprising curing an underfill material filling gaps between the second chip, the bridge, and the raised and lower surfaces of the pedestal; and providing a thermal interface material between the chips and a lid thereon; and securing the lid to the packaging substrate.
5. The process of claim 1 further comprising providing one or more conductive metal connections on a backside of the packaging substrate; and attaching the packaging substrate to a motherboard.
6. The process of claim 1 , wherein the bridge comprises wiring effective to provide electrical connection between the first chip and the second chip in a side by side arrangement.
7. The process of claim 1 , wherein the first chip comprises a microprocessor chip and the second chip comprises a power supply chip.